Machining process of half-pore plate

Abstract

The invention belongs to the technical field of printed circuit boards (PCBs), in particular discloses a machining process of a half-pore plate, which mainly adopts a wet film pore plugging method and specifically comprises the steps of: manufacturing a pore plugging template, carrying out wet film pore plugging, baking the board, routing, retreating a film, etching and the like. Through pore plugging, ink and the half-pore plate can form an integer, pore copper on the pore wall is placed between the ink and a board pore plate body, thus the pore copper can be better protected in a routing process so that the pore copper is not easy to generate pore wall copper skin tilting and flash residual, even if less quantity of copper skin tilting and flash residual is generated, the copper tilting and the flash residual can be removed through etching. Therefore, by adopting the invention, the pore wall copper skin tilting and the flash residual of a semi-metallization groove or pore can be effectively improved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board (PCB) processing, and in particular relates to a processing technology of a half-hole board. Background technique [0002] Half-hole plate, including the so-called semi-metallized slot / hole, mostly refers to the design that only half of the metallized slot / hole is left on the PCB outline, and the other half needs to be removed during molding. Such as figure 1 as shown, figure 1 It is a schematic diagram of the edge structure when the other half of the half-hole plate has not been broken, such as figure 1 As shown, it includes a plurality of metallized holes 1 on its edge, and there are conductive hole copper 11 on the hole wall of the metallized hole 1, which is separated along the dotted line to obtain a half-hole plate. [0003] For the processing of semi-metallized grooves / holes of half-plate holes, the general forming processing methods are nothing more than CNC gong bed gong ...

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Problems solved by technology

[0004] like figure 2 As shown, using the above method, due to insufficient rotation speed and wear of the gong knife, the cutting force of the gong knife is insufficient, the bonding force between the hole copper and the hole wall is insufficient, and the ductility of the hole copper (especially after surface treatment such as hot air leveling or immersion gold, etc. Increased the thickness, ductility and toughness of the metal layer, resulting in continuous cutting) and other reasons, when cutting the copper in the electroplated hole, it will inevitably cause the copper wire to remain on the section of the remaining part of the electroplated hole. Serious There is even a phenomenon that the copper skin on the hole wall is lifted

[0005] These problems in the forming process of semi-metallized slots / holes will directly affect the installation and use of customers

The copper wire and peak remaining in the semi-metallized hole are prone to problems such as weak solder joints, virtual soldering, and bridging short circuits during the soldering process of downstream SMT manufacturers.

[0006] In order to overcome the above problems, the traditional way of thinking has always been how to improve the gong board process, such as: changing the direction of the knife, the point of the knife, and the positioning method, etc. However, these methods are difficult to eliminate the problem of copper wire covering the peak

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