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Spray fluxer device

A spray type and applicator technology, which is applied in the direction of spray devices, welding equipment, printed circuit coatings, etc., can solve the problems of inability to ensure the reliability of printed circuit boards, the reduction of foaming flux applicators, and poor burrs. Achieve the effects of preventing poor bridging, shortening the coating time, and increasing the coating area

Inactive Publication Date: 2012-05-02
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the reliability of the printed circuit board cannot be ensured, such as solder fillet not being formed, bridging defect, burr defect, etc.
[0009] In order to solve this problem, it is also considered to use a foaming type flux applicator, but the foaming type flux applicator not only causes a large amount of volatile organic substances as environmental burden substances to scatter into the atmosphere, but also must carry out this foaming type flux coating. Pollution in the treatment of the applicator, maintenance of the foam cylinder, etc., which are difficult to deal with
Therefore, although the flux is applied to the entire hole of the through hole, there is a tendency that the use of the foam type flux applicator decreases in recent years.

Method used

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Embodiment Construction

[0028] The plurality of nozzles of the jet flux applicator of the present invention are preferably provided at positions where the nozzles are shifted by a predetermined distance in a direction perpendicular to the movement direction of the nozzles. If the coating ranges overlap each other, when a plurality of nozzles spray flux at the same time, the flux collides with each other and scatters, so the flux may adhere to unnecessary parts.

[0029] In the spray flux applicator of the present invention, the spray openings of a plurality of nozzles are provided at positions shifted by a predetermined distance in a direction orthogonal to the moving direction, so that the plurality of nozzles can be placed close to the printed circuit board for application, and can be installed Sufficient flux is supplied to the entire through hole in the printed circuit board, and the wettability of the through hole can be improved. This can prevent soldering defects such as poor bridging and poor bu...

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PUM

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Abstract

Flux is supplied to the entire interior of a through-hole provided in a printed substrate, and the area coated by the flux is increased. A first and a second nozzle (11, 12) are adjacent to each other in the X direction, and so that the areas coated by the first and second nozzles (11, 12) do not overlap, spray outlets (11b, 12b) are disposed at positions separated in the Y direction by just a prescribed distance A1. The first and second nozzles (11, 12) spray flux while moving in the X direction. Thus the first and second nozzles (11, 12) can be moved close to the printed substrate to coat said substrate. As a result, flux can be supplied to the entire interior of a through-hole provided in the printed substrate, and the area coated by the flux can be increased.

Description

Technical field [0001] The present invention relates to a spray fluxer for applying flux that improves solderability on a printed circuit board. Background technique [0002] As a method of soldering on a printed circuit board, there is a dipping method in which the printed circuit board is brought into contact with molten solder to perform soldering. In this dipping method, a soldering device composed of a flux applicator, a pre-heater, a jet solder tank, and a cooling device is used. For example, the following process is performed for soldering: a flux applicator is used to apply flux on On the printed circuit board, the coating portion is preheated with a preheater, solder is adhered to the jet flow solder tank, and cooled by a cooling device. [0003] When mounting large electronic components such as connectors and electrolytic capacitors on a printed circuit board, most of the small electronic components are mounted on the printed circuit board using a soldering device, and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34B23K3/00B05B13/04
CPCB23K3/082H05K3/3489H05K2203/1366H05K3/0091B23K1/203
Inventor 大清水和宪高口彰桥本昇
Owner SENJU METAL IND CO LTD
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