The invention relates to a heat-conducting
epoxy adhesive film and a preparation method thereof. The heat-conducting
epoxy adhesive film comprises the following components: 10-12 parts of
epoxy resin, 5-12 parts of a curing agent, 0.015-0.11 part of an
accelerant, 28-80 parts of
inorganic filler, 0.1-0.5 part of
pigment, 0.4-1 part of a
coupling agent and 0.3-1.2 parts of a
toughening agent, the
inorganic filler is silica
powder, the silica
powder comprises silica
powder with the particle size of 2 microns, silica powder with the particle size of 0.5 microns and silica powder with the particle size of 4 microns, and the preparation method comprises the following steps: S1, mixing materials; step S2,
coating is carried out; step S3, surface
drying; the preparation method has the advantages that the epoxy resin, the
phenolic aldehyde curing agent, the
imidazole accelerant, the silica powder, the
pigment, the
coupling agent and the flexibilizer are combined, and the
epoxy adhesive film is prepared through the steps of mixing, stirring, defoaming,
coating,
solvent removing and compounding, so that the production efficiency of the
epoxy adhesive film is improved, the highest baking temperature of a
coating oven is reduced, and the technical indexes of the
epoxy adhesive film are widened; the room-temperature storage stability is prolonged, the heat
conductivity is improved, the dimensional stability in the use process is improved, the
binding force of the
copper material is improved, and the use performance of the product is improved.