Unlock instant, AI-driven research and patent intelligence for your innovation.

Input compensated and/or overcompensated computing

An overcompensation and computing platform technology, applied in the computing field, can solve problems such as short opportunity windows and cost sensitivity

Inactive Publication Date: 2015-03-25
EMPIRE TECH DEV LLC
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Mobile and wireless systems also suffer from cost sensitivity and short windows of opportunity, which have an additional magnifying effect on computational errors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Input compensated and/or overcompensated computing
  • Input compensated and/or overcompensated computing
  • Input compensated and/or overcompensated computing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] In the following detailed description, reference is made to the accompanying drawings, which form a part of this description. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative examples or embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other examples or embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented here. It will be readily understood that the various aspects of the present disclosure, as generally described herein and illustrated in the drawings, may be arranged, replaced, combined and designed in a wide variety of different configurations, all of which are expressly are contemplated and form part of this disclosure.

[0023] Furthermore, the present disclosure relates to methods, apparatus, systems and computer program products related to input compensat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Techniques are generally described for correcting computation errors via input compensation and / or input overcompensation. In various examples, errors of a computation may be detected, and input compensation and / or overcompensation to correct the errors may be created. The disclosed techniques may be used for power and / or energy minimization / reduction, and debugging, among other applications. Other embodiments and / or applications may be disclosed and / or claimed.

Description

technical field [0001] The present application relates generally to the field of computing and, more particularly, to input compensation calculations and / or input overcompensation calculations. Background technique [0002] Computational errors are ubiquitous in computing systems, communication systems, and storage systems. There can be a wide variety of errors, ranging from transmissible to permanent, from design to manufacturing, from errors that have no or negligible effect to those that may make most of the results and / or or errors in which the data have changed significantly. There may be broad consensus that the number and impact of errors increases with each new generation of silicon and other implementation technologies. The increase in the number and impact of errors is likely due to the exponential shrinking of feature sizes, low-voltage operation, and exponential increases in integration. [0003] Computational errors can have the greatest impact in low-power d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F11/30
CPCG06F11/0793G06F11/0721G06F9/451
Inventor 米奥德拉格·波特科尼亚克
Owner EMPIRE TECH DEV LLC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More