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Preparation method for inhomogeneous dielectric substrate

A technology of inhomogeneous media and substrates, applied in the field of manufacturing and processing of metamaterial substrates, can solve problems such as difficult to meet the electromagnetic characteristics of dielectric substrates, and achieve the effect of meeting the requirements of electromagnetic characteristics and simple preparation process

Active Publication Date: 2013-03-13
SHENZHEN KUANG CHI GANG DA INNOVATIVE TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most traditional PCB substrates are homogeneous dielectric substrates, which are difficult to meet the requirements for electromagnetic properties of dielectric substrates.

Method used

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  • Preparation method for inhomogeneous dielectric substrate
  • Preparation method for inhomogeneous dielectric substrate
  • Preparation method for inhomogeneous dielectric substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] see figure 1 , is a flowchart of a method for preparing a heterogeneous dielectric substrate provided in Embodiment 1 of the present invention, and the method includes:

[0020] S11: configuring a resin solution with a preset concentration.

[0021] Wherein, the resin solution with the preset concentration is polysulfone (PSF / PSU) solution; or polyvinylidene fluoride (PVDF) solution. The concentration of the polysulfone solution is 15-20%; the concentration of the polyvinylidene fluoride solution is 20-25%.

[0022] S12: coating the resin solution on the upper surface of the non-woven fabric to form a layer of liquid film.

[0023] Wherein, the shape of the non-woven fabric is square or rectangular.

[0024] S13: Hang the non-woven fabric with the liquid film on the upper surface vertically between the two cold and hot spray heads.

[0025] S14: Turn on the cold and hot spray heads, and take away the water-soluble organic solvent in the liquid film through water vap...

Embodiment 2

[0031] see figure 2 , is a flowchart of a method for preparing a heterogeneous dielectric substrate provided in Embodiment 2 of the present invention, and the method includes:

[0032] S21: Prepare a polysulfone solution with a concentration of 17%.

[0033] S22: Coating a polysulfone solution with a concentration of 17% on the upper surface of the square non-woven fabric to form a layer of liquid film.

[0034] S23: Hang the square non-woven fabric with the liquid film on the upper surface vertically between the two cold and hot spray heads.

[0035] S24: Turn on the cold and hot spray heads, adjust the water vapor ejection volumes of the cold and hot spray heads until a constant spray speed is finally reached, and spray for 10 minutes.

[0036] Wherein, the water vapor ejection amount of the cold spray head is greater than the water vapor ejection amount of the hot spray head.

[0037] S25: remove the polysulfone liquid film, put it into a forced air drying oven at a tem...

Embodiment 3

[0040] see image 3 , is a flow chart of a method for preparing a heterogeneous dielectric substrate provided in Embodiment 3 of the present invention, and the method includes:

[0041] S31: Prepare a polyvinylidene fluoride solution with a concentration of 23%.

[0042] S32: Coating a polyvinylidene fluoride solution with a concentration of 23% on the upper surface of the rectangular non-woven fabric to form a layer of liquid film.

[0043] S33: vertically hang the rectangular non-woven fabric with the liquid film on the upper surface between the two cold and hot spray heads.

[0044] S34: Turn on the cold and hot spray heads, adjust the water vapor spraying volume of the cold and hot spray heads until a constant spray speed is finally reached, and spray for 8 minutes. During this process, the water vapor carried away the water-soluble organic solvent in the liquid film.

[0045] Wherein, the water vapor ejection amount of the cold spray head is greater than the water vapo...

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Abstract

The embodiment of the invention provides a preparation method for an inhomogeneous dielectric substrate. The preparation method comprises the following steps of: preparing a resin solution with a preset concentration; coating the resin solution on the upper surface of a non-woven fabric so as to form a layer of liquid film; vertically suspending the non-woven fabric of which the upper surface is provided with the liquid film between a cold injection head and a hot injection head; opening the cold injection head and the hot injection head so as to take water-soluble organic solvents away the liquid film by water vapor; taking off the liquid film, putting the liquid film in a drying oven for drying, and then, obtaining the inhomogeneous dielectric substrate. The preparation method lowers the complexity for preparing the inhomogeneous dielectric substrate.

Description

【Technical field】 [0001] The invention relates to the technical field of manufacturing and processing metamaterial substrates, in particular to a method for preparing a heterogeneous dielectric substrate. 【Background technique】 [0002] In recent years, with the rapid development of high-tech such as radar detection, satellite communication, and aerospace, as well as the rise of research fields such as anti-electromagnetic interference, stealth technology, and microwave anechoic chambers, research on microwave-absorbing materials has attracted more and more attention. Metamaterials can exhibit very wonderful electromagnetic effects, and can be used in the fields of wave-absorbing materials and invisible materials, becoming a research hotspot in the field of wave-absorbing materials. [0003] The properties and functions of metamaterials mainly come from their internal structures. How to accurately prepare three-dimensional fine structures with periodic arrangements has becom...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J9/28C08J5/18C08L81/06C08L27/16
Inventor 刘若鹏金曦张影
Owner SHENZHEN KUANG CHI GANG DA INNOVATIVE TECH LTD
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