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Bga socket with improved structure

A socket and contactor technology, which is applied in the parts of connecting devices, fixed/insulating contact members, coupling devices, etc., can solve the problems of reducing production performance, assembly tolerances, and increasing product unit price, so as to reduce product unit price and improve production. performance effect

Active Publication Date: 2015-01-14
MICRO CONTACT SOLUTION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Due to the large number of components in this structure, when different components are combined, poor conditions occur due to assembly tolerances.
[0007] And due to the occurrence of bad conditions will reduce the production performance
[0008] Finally, it will cause the unit price of the entire product to rise

Method used

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  • Bga socket with improved structure
  • Bga socket with improved structure
  • Bga socket with improved structure

Examples

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Embodiment Construction

[0058] The present invention relates to a BGA socket with improved structure, and the preferred embodiments of the present invention will be described in detail below.

[0059] First of all, the terms and words used in this specification and claims should not be limitedly interpreted to the usual or dictionary meanings, but should be properly defined as the concept of the terms used by the inventor to describe the invention in the best mode, The meaning and concept contained in the technical idea of ​​the present invention should be interpreted based on principle.

[0060] Therefore, the embodiment described in this specification and the structure illustrated in the accompanying drawings are only the most preferred implementation example of the present invention, and cannot fully represent the technical ideas of the present invention. Various equivalents and modified examples of this embodiment can be substituted.

[0061] For the improved BGA socket related to an embodiment ...

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PUM

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Abstract

Provided is a BGA socket with an improved structure which requires no pins for fixing contactors to fix panel. In the invention, the fixing body comprises: multiple first pin head holes which run through the pin head of the contactor, and a step part which fixes the contactor body fastened inside the first pin head holes in an up-and-down manner. The contactor body comprises: a fixed keyhole formed at the central position of the contactor body in a penetrating manner, and a jaw formed at the upper side of the fixed keyhole, comprising a slope with an increasingly narrowing slope from top to bottom, and inhibiting the downside motion of the contactor when the upside of the contactor is in the fastening static state. Compared with the conventional BGA socket, the BGA socket of the utility model simplifies the assembling members, thereby being capable of avoiding the poor assembling caused by assembling tolerance when different members are combined. Moreover, the production performance can be improved by avoiding the happening of poor assembling situations. Also, the unit price of the product can be generally cut down.

Description

technical field [0001] The present invention relates to a BGA socket, and more particularly, to a BGA socket of an improved structure without using a pin fixing panel for fixing a contactor. Background technique [0002] BGA (Ball Grid Array, ball grid array structure) in the form of IC packaging is different from other forms of IC. IC terminals, namely solder balls, are arranged on the entire bottom surface of the IC, thus innovatively improving the size and thickness of the IC. In BGAIC, Usually, the intervals between solder balls are 0.5mm, 0.75mm, 0.8mm, 1.0mm, 1.27mm, 1.6mm, etc., the diameter of the solder balls is about 0.3mm to 0.9mm, and the height of the solder balls from the bottom of the IC is 0.2 mm to about 0.6mm, the smaller the interval between the solder balls, the smaller the diameter and height of the solder balls. [0003] On the other hand, a "BGA socket (Korean Authorized Utility Model No. 0356022)" is disclosed as prior art using a BGA test socket to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/02H01R13/40H01R13/502H01R33/74
Inventor 魏圣烨金韩一
Owner MICRO CONTACT SOLUTION