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Method for manufacturing circuit boards

A manufacturing method and circuit board technology, which are applied in the manufacturing of multi-layer circuits and the formation of electrical connections of printed components, can solve the problems of difficult to accurately test the continuity of the circuit board, loss of the circuit board, etc.

Active Publication Date: 2012-05-30
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the destructive test of the circuit board not only loses the tested circuit board, but also makes it difficult to accurately test the continuity of each circuit board

Method used

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  • Method for manufacturing circuit boards
  • Method for manufacturing circuit boards
  • Method for manufacturing circuit boards

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Embodiment Construction

[0060] The manufacturing method of the circuit board provided by the technical solution will be further described in detail below in conjunction with multiple drawings and embodiments.

[0061] Step 1, please also refer to figure 1 and figure 2 , providing an inner layer circuit board 100 formed with conductive lines.

[0062]In this embodiment, the double-layer circuit board formed with conductive circuits is an inner-layer circuit board, and an eight-layer circuit board made of the above-mentioned double-layer circuit board is used as an example for illustration. The circuit board 100 includes a product area 101 and a non-product area 102 adjacent to each other, and defines a boundary between the product area 101 and the non-product area 102 as an intersection 105 . The direction parallel to the intersection surface 105 is set as the width direction of the circuit board 100 , and the direction perpendicular to the intersection surface 105 is set as the length direction of...

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Abstract

The invention discloses a method for manufacturing circuit boards, which includes steps of manufacturing conductive layers and product holes on the circuit boards while manufacturing a plurality of via holes and pads in non-product areas of the circuit boards, forming a path between the via holes and the welding trays, and judging electric conductance performance of the conductive layers and the product holes in the product areas of the circuit boards by testing conductive conditions of the path formed between the via holes and the pads, wherein the via holes in different layers are communicated to each other. Accordingly, destructive test to the circuit boards can be avoided, and performance of the via holes for electroplating of the circuit boards can be judged simply and conveniently.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a circuit board. Background technique [0002] Printed circuit boards have been widely used due to their advantages such as high assembly density. For the application of high-density interconnect circuit boards, please refer to the literature Takahashi, A.O oki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High density multilayer printed circuit board for HITAC M-880 , IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] In recent years, with the continuous improvement of circuit board density, the aperture of interlayer via holes has become smaller and smaller. Usually, the continuity of the circuit board is sampled and tested after the circuit board is manufactured. The methods currently used are generally to randomly select a certain number of samples from the same batch of products and do...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40H05K3/46
Inventor 谢寒飞唐莺娟
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD