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Copper foil composite

A composite, copper foil technology, used in the manufacture of printed circuit precursors, electronic equipment, printed circuits, etc., can solve problems such as poor electromagnetic wave shielding, and achieve the effect of improving processability

Active Publication Date: 2012-05-30
JX NIPPON MINING & METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In contrast, when the shielded body is covered with copper braiding (braiding), etc., the shielded body is exposed in the mesh part, and the electromagnetic wave shielding property is poor.

Method used

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  • Copper foil composite
  • Copper foil composite

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0048] 1. Electromagnetic wave shielding material

[0049]

[0050] Tough copper ingots are hot-rolled, and after surface cutting to remove oxides, cold-rolling, annealing and pickling are repeated to make it thinner to a specified thickness, and finally annealing is performed to obtain workability-guaranteed copper foil. The tension during cold rolling and the rolling conditions (reduction conditions) in the width direction of the rolled material are kept uniform so that the copper foil has a uniform structure in the width direction. In the subsequent annealing, the temperature was controlled using a plurality of heaters, and the temperature of copper was measured and controlled so as to form a uniform temperature distribution in the width direction. Copper foil is produced by adding a predetermined amount of Sn or Ag to several copper ingots.

[0051] A commercially available biaxially stretched PET film of a predetermined thickness was bonded to the above-mentioned copp...

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PUM

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Abstract

Provided is a copper foil composite with improved processibility. The copper foil composite is constituted of a laminate of a copper foil and a resin layer. The copper foil has a breaking strain of not less than 5%. The copper foil composite satisfies the relation represented by the following formula: (F T) / (f t)=1, where t denotes the copper foil thickness, f denotes the stress in the copper foil at a tensile strain of 4%, T denotes the thickness of the resin layer, and F denotes the stress in the resin layer at a tensile strain of 4%.

Description

technical field [0001] The present invention relates to a copper foil composite suitably used as an electromagnetic wave shielding material, a copper laminate for FPC, and a substrate requiring heat dissipation. Background technique [0002] A copper foil composite obtained by laminating copper foil and a resin film can be used as an electromagnetic wave shielding material (for example, Patent Document 1). Copper foil has electromagnetic wave shielding properties, and a resin film is laminated to reinforce the copper foil. As a method of laminating the resin film on the copper foil, there are a method of laminating the resin film on the copper foil with an adhesive, a method of vapor-depositing copper on the surface of the resin film, and the like. In order to ensure electromagnetic wave shielding properties, it is necessary to make the thickness of the copper foil several micrometers or more, so the method of laminating a resin film on the copper foil is inexpensive. [0...

Claims

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Application Information

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IPC IPC(8): B32B15/08H05K9/00
CPCB32B2307/50B32B2307/54H05K1/09B32B2307/70B32B2307/212H05K2201/0358H05K2201/0355B32B15/20B32B7/02B32B2457/08B32B15/08H05K9/0084B32B15/09H05K3/022Y10T428/31678H05K9/00
Inventor 冠和树
Owner JX NIPPON MINING & METALS CO LTD
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