Multilayer heat-conductive sheet, and manufacturing method for multilayer heat-conductive sheet
A technology of heat conduction sheet and heat conduction layer, which is applied in semiconductor/solid-state device manufacturing, cooling/ventilation/heating transformation, semiconductor devices, etc., can solve the problems of reduced performance of heat conduction sheet, poor adhesion, interface damage, etc., to improve processability , the effect of improving reworkability
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[0078] The thermoplastic resin and the inorganic filler were dispersed and dissolved in a mixed solvent of toluene:MEK (methyl ethyl ketone, methyl ethylketone) = 1:1 to obtain a non-tacky layer raw material solution with a solid content of 10%.
[0079] The types and names of the thermoplastic resin and inorganic filler, the average particle diameter of the inorganic filler (column "Filler D50"), and the weight ratio of the inorganic filler to the thermoplastic resin are shown in Examples 1 to 6 and Comparative Examples 1 to 4 in Table 1 below. .
[0080] Next, apply the non-adhesive layer raw material solution with a bar coater, and dry it with a drier at 90° C. for 5 minutes to obtain the following: figure 2 (a) Non-adhesive layer 11 shown.
[0081] The thickness of the non-adhesive layer 11 is shown in Table 1 below.
[0082] [Table 1]
[0083] Table 1 Contents of non-adhesive layer
[0084] .
[0085] The preparation ingredients are the heat conduction layer raw m...
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