Multilayer heat-conductive sheet, and manufacturing method for multilayer heat-conductive sheet

A technology of heat conduction sheet and heat conduction layer, which is applied in semiconductor/solid-state device manufacturing, cooling/ventilation/heating transformation, semiconductor devices, etc., can solve the problems of reduced performance of heat conduction sheet, poor adhesion, interface damage, etc., to improve processability , the effect of improving reworkability

Active Publication Date: 2016-10-12
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] However, the heat conduction sheet obtained by the above method has the following problems: the flexibility of the heat conduction sheet is deteriorated, and the thermal conductivity is reduced, resulting in a decrease in the performance of the heat conduction sheet.
[0012] Furthermore, the coating film of the non-adhesive layer and the thermally conductive layer requiring flexibility differ in ease of deformation (ease of elongation

Method used

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  • Multilayer heat-conductive sheet, and manufacturing method for multilayer heat-conductive sheet
  • Multilayer heat-conductive sheet, and manufacturing method for multilayer heat-conductive sheet
  • Multilayer heat-conductive sheet, and manufacturing method for multilayer heat-conductive sheet

Examples

Experimental program
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Example Embodiment

[0077] Example

[0078] The thermoplastic resin and the inorganic filler were dispersed and dissolved in a mixed solvent of toluene:MEK (methyl ethylketone)=1:1 to obtain a non-sticky layer raw material liquid with a solid content of 10%.

[0079] The types and names of thermoplastic resins and inorganic fillers, the average particle size of inorganic fillers ("filler D50" column), and the weight ratio of inorganic fillers to thermoplastic resins are shown in Examples 1 to 6 and Comparative Examples 1 to 4 in Table 1 below. .

[0080] Next, the non-sticky layer raw material liquid was coated with a bar coater, and dried with a dryer at 90°C for 5 minutes to obtain figure 2 (a) The non-adhesive layer 11 shown.

[0081] The thickness of the non-adhesive layer 11 is shown in Table 1 below.

[0082] [Table 1]

[0083] Table 1 Contents of non-sticky layer

[0084] .

[0085] The preparation composition is the heat conductive layer raw material liquid in the following Table 2, which is coated...

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Abstract

The purpose of the present invention is to prevent delamination caused by interfacial fracture between a tack-free layer (11) and a heat-conductive layer (12). Within a tack-free layer (11), an inorganic filler (22) of median particle size of 0.5 mu m is included in a thermoplastic resin (21) that is of a glass transition temperature of greater than or equal to 60 DEG C. An adhesive surface (26) is texurized, and a heat-conductive layer (12), which is in contact with the adhesive surface (26), is placed. Without strengthening the adhesive force of the surface on the opposite side of the adhesive surface (26), adhesive force between the tack-free layer (11) and the heat-conductive layer (12) is strengthened as a result of an anchoring effect caused by the textured adhesive surface (26).

Description

technical field [0001] The present invention relates to a thermally conductive sheet that is attached to electronic devices and the like to improve heat dissipation. Background technique [0002] The heat conduction sheet is arranged between electronic devices, etc. that become heat sources, and radiators such as heat sinks and housings, and is used to improve the heat dissipation of electronic devices. [0003] As a heat conduction sheet, adhesiveness and flexibility are required from the standpoint of workability when using a heat conduction sheet to assemble an electronic device and a heat sink. Since a material with high flexibility has strong adhesion, it may not be possible to use a heat conduction sheet. There is a gap between electronic devices and heat dissipation devices such as radiators. [0004] In addition, if the adhesiveness is strong, the detachment workability of the electronic device from the heat dissipation device is poor, and even if the electronic dev...

Claims

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Application Information

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IPC IPC(8): H01L23/36H01L23/373H05K7/20
CPCH01L23/36H01L23/3737H01L2924/0002H01L2924/00H01L21/4803H01L23/3735
Inventor 杉田纯一郎
Owner DEXERIALS CORP
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