Temperature-equalizing plate and device and method for manufacturing temperature-equalizing plate

Abstract

The invention relates to a temperature-equalizing plate and a device and a method for manufacturing the temperature-equalizing plate. The temperature-equalizing plate comprises an upper cover plate and a lower cover plate, wherein the upper cover plate and the lower cover plate are combined to form working fluid accommodating space; a filling opening which is used for vacuumizing and filling working fluid is formed at the juncture of the edge of the upper cover plate and the edge of the lower cover plate and is communicated with the working fluid accommodating space; the upper cover plate and the lower cover plate are subjected to laminating fusion welding for the first time by an ultrasonic metal welding machine; and after the working fluid is filled into the working fluid accommodating space, the filling opening is subjected to the laminating fusion welding by the ultrasonic metal welding machine again. The temperature-equalizing plate and the device and the method for manufacturing the temperature-equalizing plate have the advantages that (1) the requirement on the surface of welded metal is low, namely welding can be performed under the condition of oxidation or electroplating; (2) the welding time is short, and scaling powder, gas and welding flux are saved; and (3) sparks are avoided in the welding process, so the method for manufacturing the temperature-equalizing plate is environment-friendly and safe. Therefore the device and the method for manufacturing the temperature-equalizing plate is easy to operate, high in yield, quick and safe, and the requirements of a production process of mass production and cost reduction are met.

Description

technical field [0001] The invention relates to a vapor chamber, a vapor chamber manufacturing device and a vapor chamber manufacturing method, in particular to a vapor chamber used for LED lighting fixtures, a vapor chamber manufacturing device and a vapor chamber manufacturing method. [0002] Background technique [0003] The vapor chamber is an extension of the heat pipe technology. The working principle of the vapor chamber is the same as that of the heat pipe. It includes four main cycle steps of conduction, evaporation, convection and condensation to quickly remove heat from the heat source. Its core function is heat conduction. It transfers heat through the vapor-liquid phase transition of the working fluid in a fully enclosed vacuum chamber, and has extremely high thermal conductivity, up to hundreds of times the thermal conductivity of pure copper. [0004] At present, vapor chambers are usually used for electronic products that require small volume or rapid heat ...

AI Technical Summary

Problems solved by technology

[0010] The present invention designs a vapor chamber, a vapor chamber manufacturing device and a vapor chamber manufacturing method. The technical problems it solves are (1) the existing uniform temperature The welding method between the upper and lower cover plates cannot achieve the ideal vacuum degree and the sealing capacity of the working fluid, which affects the heat conduction effect of the vapor chamber; (2) the existing two cover plate sealing and injection port sealing technologies use flame fusion, and there is a process Slow time, long staff training time, high risk, etc.

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