Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof

A technology of LED packaging and epoxy resin, applied in the direction of epoxy resin glue, organic chemistry, adhesive type, etc., can solve the problems of epoxy resin performance improvement, lack of organic silicon chain segments, etc., to improve flexibility, improve Anti-yellowing performance, anti-yellowing effect

Inactive Publication Date: 2014-03-26
ZHEJIANG Z LIGHT OPTOELECTRONICS
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The above-mentioned invention adopts the method of blending and compounding to prepare organosilicon-modified epoxy resin. Such materials are only crosslinking agents that are organosilicon compounds. On the one hand, there are compatibility problems between crosslinking agents, fillers and epoxy resins. On the one hand, Lack of silicone segments in the material backbone, resulting in limited performance improvement for epoxies

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof
  • Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof
  • Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] (1) Add 22.8g D4 (0.075mol), 68.5g (0.3mol) bisphenol A, 46.4g (0.5mol) epichlorohydrin to a 250ml clean three-necked bottle, mix well at 60°C, and then add 20g Sodium hydroxide, polymerize at 60°C for 3 hours, then add 150g of toluene, let the product dissolve completely under stirring, then let it stand for stratification, and reflux the upper layer product to remove water under stirring, continue to reflux for 1 hour after no bubbles appear, and let it stand , cooling, filtering, and desolventization under reduced pressure to obtain 115.8 g of colorless and transparent organosilicon-modified epoxy resin, whose viscosity is 12500 mPa·S, and its chemical formula after identification is CH 2 CHOCH 2 [OC 6 h 4 C(CH 3 ) 2 C 6 h 4 O] 3 [CH 2 CHOHCH 2 ] 3 [(CH 3 ) 2 SiO] 3 CH 2 CHCH 2O, its infrared spectrum is shown in figure 1 .

[0035] (2) Take 20g of the product obtained in (1), add 5g of epoxy diluent 2-cresyl glycidyl ether, 5.0g of nano-silicon diox...

Embodiment 2

[0038] (1) Add 22.8g of D3 (0.075mol), 45.7g (0.2mol) of bisphenol A, 37.2g (0.4mol) of epichlorohydrin into a 250ml clean three-necked bottle, mix well at 60°C, and then add 20g Potassium hydroxide, polymerize at 80°C for 2 hours, then add 150g of xylene, let the product dissolve completely under stirring, and then let it stand for stratification, and reflux the upper layer product to remove water under stirring, and continue to reflux for 2 hours after no bubbles appear, and let it stand place, cool, filter, and remove the solvent under reduced pressure to obtain 88.8 g of colorless and transparent organosilicon-modified epoxy resin with a viscosity of 8500 mPa·S, and its chemical formula is identified as CH 2 CHOCH 2 [OC 6 h 4 C(CH 3 ) 2 C 6 h 4 O] 2 [CH 2 CHOHCH 2 ] 2 [(CH 3 ) 2 SiO] 3 CH 2 CHCH 2 O.

[0039] (2) Take 25g of the product obtained in (1), add 5g of epoxy diluent 4-tert-butylphenyl glycidyl ether, 6.0g of nano-silica, mix well in a planetary m...

Embodiment 3

[0042] (1) Add 22.8g of D5 (0.075mol), 68.5g (0.3mol) of bisphenol A, 46.4g (0.5mol) of epichlorohydrin into a 250ml clean three-necked bottle, mix well at 60°C, and then add 20g Sodium hydroxide, polymerize at 60°C for 3 hours, then add a mixture of 75g toluene and 75g xylene, let the product dissolve completely under stirring, then let it stand for stratification, and reflux the upper layer product under stirring to remove water, until no bubbles appear Continue to reflux for 1h, let stand, cool, filter, and remove the solvent under reduced pressure to obtain 110g of colorless and transparent silicone modified epoxy resin, whose viscosity is 11000mPa·S, and its chemical formula is identified as CH 2 CHOCH 2 [OC 6 h 4 C(CH 3 ) 2 C 6 h 4 O] 3 [CH 2 CHOHCH 2 ] 3 [(CH 3 ) 2 SiO] 3 CH 2 CHCH 2 O.

[0043] (2) Take 20g of the product obtained in (1), add 5g of epoxy thinner neodecanoic acid oxirane methyl methyl ester, and 5.0g of nano silicon dioxide, and mix even...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
Login to View More

Abstract

The invention provides an organic silicon modified epoxy resin for packaging an LED (Light Emitting Diode), and a preparation method and an application thereof. According to the preparation method, an organic silicon monomer is directly polymerized with bisphenol A and epoxy chloropropane, for preparing the organic silicon modified epoxy resin with epoxy groups at the tail end and dimethyl silica chain links contained in a main chain. The organic silicon modified epoxy resin for packaging the LED is prepared; the flexibility, the weather resistance and the ultraviolet radiation resistance of the packaging materials are improved; and the organic silicon modified epoxy resin is difficult to yellow.

Description

(1) Technical field [0001] The invention relates to a silicone-modified epoxy resin, a preparation method thereof, and an application of the resin in preparing an adhesive film for LED packaging. (2) Background technology [0002] Light-emitting diode (LED) lighting consumes only 1 / 10 of the power of traditional light sources. It has the characteristics of not using mercury that seriously pollutes the environment, small size, and long life. It first enters industrial equipment, instruments, traffic lights, automobiles, and backlights. and other special lighting fields. With the improvement of LED performance, LED is expected to replace traditional light sources such as incandescent lamps and fluorescent lamps and become the fourth generation of lighting sources. [0003] Epoxy resin refers to a polymer chain structure containing two or more epoxy groups, with organic compounds such as aliphatic, alicyclic or aromatic as the skeleton and forming a useful thermosetting produc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/30C08G59/06C07F7/18C09J163/00C09J7/00H01L33/56
Inventor 朱晓飚胡建红郑群亮杨雄发
Owner ZHEJIANG Z LIGHT OPTOELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com