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Low gas permeable silicone resin composition and optoelectronic device

一种硅氧烷树脂、气体渗透性的技术，应用在电固体器件、半导体器件、半导体/固态器件零部件等方向，能够解决变色等问题

Active Publication Date: 2012-07-04
SHIN ETSU CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above-mentioned silicone resins have light resistance, heat discoloration resistance, and impact resistance, in phenyl-containing silicone resins whose adhesiveness is increased by adding epoxy groups, etc., or in which phenyl-containing resins are used in combination Discoloration was still present when tested for sulfide in durable resins derived from linear phenylhydrooligomeric organosiloxanes

Method used

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  • Low gas permeable silicone resin composition and optoelectronic device
  • Low gas permeable silicone resin composition and optoelectronic device
  • Low gas permeable silicone resin composition and optoelectronic device

Examples

Experimental program
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Effect test

preparation example Construction

[0106] Preparation of Silicone Resin Composition

[0107] The silicone resin composition can be prepared by simultaneously or sequentially stirring, dissolving, mixing and dispersing the above-mentioned components, if necessary, while heating. Most commonly, compositions are formulated and stored in two parts, one part including components (A), (B) and (C) and the other part including components (B) and (D), so that no curing reaction. In use, the two parts are mixed to allow the composition to cure. In particular, separate storage of components (C) and (D) is recommended because of potential dehydrogenation reactions of components (C) and (D) when stored together in the same part. The composition can be formulated in one portion if a small amount of a cure retardant such as acetylene alcohol is added.

[0108] The equipment used for stirring and mixing operations is not particularly limited, although a mixer equipped with stirring and heating facilities such as an automati...

Embodiment 1 to 5

[0138] The silicone resin composition was prepared by mixing the components prepared in Synthesis Examples 1 to 4 and 6 with the following components according to the formulation shown in Table 1.

[0139] (A') Vinyldimethylsiloxy-terminated phenylmethylpolysiloxane having the following general formula.

[0140] Phenyl content: 30wt%;

[0141] Vinyl equivalent: 0.0185mol / 100g

[0142]

[0143] where X=30 and Z=68.

[0144] (B) Phenyl-containing branched methylhydrogen polysiloxane 2 having the following general formula.

[0145] Hydrogen release: 170.24ml / g (0.760mol / 100g)

[0146]

[0147] (C) Platinum catalyst: octyl alcohol-modified solution of chloroplatinic acid (Pt concentration: 2 wt%).

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Abstract

A silicone resin composition comprising (A) an organopolysiloxane containing silicon-bonded aryl and alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane, and (C) an addition reaction catalyst is low gas permeable. An optoelectronic device encapsulated therewith is highly reliable.

Description

technical field [0001] The present invention relates to low gas permeability silicone resin compositions useful as optoelectronic component encapsulants, and optoelectronic devices encapsulated by said silicone products. Background technique [0002] Recently, high-intensity LED products characterized by high luminous luminance and necessarily accompanied by significant heat release have become commercial products. In addition to being used as backlight elements in liquid crystal displays and mobile phones, LED products are now finding wide application as general lighting and the like. WO2009 / 154260 discloses an encapsulation material with heat resistance, light stability and weather resistance, wherein epoxy-containing siloxane is added to phenyl-containing siloxane resin to improve its adhesion. WO 2007 / 100445 discloses a siloxane resin composition containing a phenyl-containing resin and a linear phenyl-containing hydrogen-oligomeric organosiloxane, which can be used to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05H01L33/56
CPCC08G77/80H01L23/296C08G77/20C08G77/12C08L83/04H01L2924/0002Y10T428/31663C08L83/00H01L2924/00C08K3/013C08L2205/02
Inventor 浜本佳英柏木努
Owner SHIN ETSU CHEM CO LTD
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