Method for avoiding wafer damage in molding process of wafer level packaging

Abstract

The invention relates to a method for avoiding wafer damage in a molding process of wafer level packaging of a wafer during preparation of a wafer level package. Due to a scribe line on the front surface of a wafer, fluid molding compounds are easy to bleed from the scribe line before solidification, molding bleeding positioned at the edge of the wafer is generated, and if the wafer and a molding mould fixture are adhered together by the bled molding compounds, the wafer is damaged once the fixture is separated from the wafer. The method includes the steps of firstly, grinding the edge of the wafer to form an annular grinding groove which surrounds the edge of the wafer and is recessed in the front surface of the wafer; and then performing molding so that the molding compounds can be effectively prevented from bleeding.

Description

technical field [0001] The present invention generally relates to a method for preparing a wafer-level package, and more precisely, the present invention relates to a method for preventing wafers from being damaged in the plastic sealing process of the wafer-level package during the preparation of the wafer-level package. Methods. Background technique [0002] Different from the traditional chip packaging method, WLCSP (Wafer Level ChipScale Packaging) is packaged and tested on the entire wafer first, and then cut into individual IC particles, so the volume of the package after packaging That is, almost equal to the original size of the bare chip. [0003] Usually, many chips (Die) are separated from the wafer by dicing the wafer (Wafer Saw), and the cutting line of the dicing knife in this process depends on the scribe lines (Scribe Line) arranged on the wafer. [0004] In the molding process of wafer-level packaging, the initial state of the molding compound is liquid or...

AI Technical Summary

Problems solved by technology

The technical solution of this patent application is to deal with the problem of poor adhesion between the edge of the wafer and the carrier substrate, but not to the process of plastic sealing the wafer in wafer level packaging

[0008] The field we are concerned about: In the molding process of wafer-level packaging, in terms of reducing the overflow of molding compound, preventing wafer damage, and solving the problem that the edge of the wafer is not completely covered by the molding compound, the above-mentioned patent application scheme or Currently existing technologies are difficult to effectively improve it

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