Bus bar, printed circuit board (PCB) and surface mounting method of bus bar

Abstract

The invention discloses a bus bar, a printed circuit board (PCB) and a surface mounting method of the bus bar. The bus bar is inserted into a locating hole of the PCB to be located through a locating pin of the bus bar or inserted into locating holes of the bus bar and the PCB to be located through an auxiliary locating pin to be soldered by adopting reflow soldering or wave soldering. The bus bar has a self-locating function, solves the problem that a slender bus bar with large area is easy to shift during a surface mount technology (SMT) manufacturing process, can prevent heat conduction from being affected caused by poor contact between the bus bar and the PCB, prolongs service life of products, and improves reliability of the products.

Description

[technical field] [0001] The invention relates to a printed circuit board, in particular to a bus bar, a PCB circuit board and a mounting method for the bus bar. [Background technique] [0002] The bus bar is attached to the PCB board, which plays the role of carrying large current and conducting heat. It is often used on circuit boards of high-power products. [0003] In the manufacturing process of PCB circuit boards with bus bars, the traditional process adopts solder paste process and soldering with reflow soldering, but for slender bus bars with large area, due to the deformation of the bus bars themselves, improper manual Due to chain vibration and other reasons, the bus bar may be displaced during the SMT process, thereby affecting the heat conduction effect of the bus bar. In the SMT process, although some auxiliary positioning fixtures can be used to solve this problem, the effect is not ideal, and the tooling cost will also be increased. [Content of the inventi...

AI Technical Summary

Problems solved by technology

[0003] In the manufacturing process of PCB circuit boards with bus bars, the traditional process adopts solder paste process and soldering with reflow soldering, but for slender bus bars with large area, due to the deformation of the bus bars themselves, improper manual Due to chain vibration and other reasons, the bus bar may be displaced during the SMT process, thus affecting the heat conduction effect of the bus bar

In the SMT process, although some auxiliary positioning fixtures can be used to solve this problem, the effect is not ideal, and the tooling cost will also be increased

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