The invention discloses a
copper embedded block heat
radiation substrate comprising a substrate body, wherein the substrate body is provided with a
copper embedded block via groove, a heat
radiation copper block is arranged in the copper embedded block via groove, and a surface of the heat
radiation copper block is level with a surface of the heat radiation substrate. The heat radiation copper block is arranged in the substrate, a top face and a bottom face of the heat radiation copper block are exposed from an outer part of the substrate, and the heat radiation substrate is enabled to have adouble face heat radiation structure; compared with a conventional copper embedded block PCB board only capable of single
surface heat radiation, the copper embedded block heat radiation substrate disclosed in the invention is advantaged by improved heat radiation efficiency. The invention also discloses a manufacturing method for the copper embedded block heat radiation substrate; a two time
etching method is adopted for manufacturing the heat radiation copper block of which double surfaces are exposed, size precision of the heat radiation copper block is improved in such a
processing mannerthat a bottom part heat radiation copper block is manufactured after pressing operation, and copper blocks are bonded together via two time pressing operation; a problem that the copper blocks are prone to deviating, loosening,
cracking and the like; copper block
processing efficiency and quality stability can be improved.