Machine and method for grinding and polishing ultra-long and ultra-thin quartz plate

A quartz plate and polishing machine technology, applied in the field of grinding and polishing machines, can solve the problems of large and heavy equipment, and achieve the effects of simple operation, convenient use and reasonable structure

Inactive Publication Date: 2012-07-11
蔡桂芳
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is to grind and polish with a single-axis plane grinder according to the classical polishing method. When the swing is 40%, for example, to polish a quartz glass plate with a length of 1000mm, a width of 200mm, and a thickness of 3mm, the grinding disc of the single-axis machine has also reached 1.5m. Manufacture of long quartz glass plate grinding and polishing equipment according to the existing grinding and polishing machine principle will make the equipment larger and heavier and more cumbersome

Method used

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  • Machine and method for grinding and polishing ultra-long and ultra-thin quartz plate
  • Machine and method for grinding and polishing ultra-long and ultra-thin quartz plate
  • Machine and method for grinding and polishing ultra-long and ultra-thin quartz plate

Examples

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Effect test

Embodiment 1

[0014] Embodiment 1, with reference to figure 1 , 2, a kind of lapping and polishing machine that is applicable to ultra-long and ultra-thin quartz plate, it comprises millstone 4, is provided with cover mold 1 above millstone 4, is provided with workpiece placement groove on cover mold 1, and workpiece placement groove bottom is provided with The gasket 2 and the mold set 1 are fixedly connected to the translation shaft 6 through the connecting rod 5, and the translation shaft 6 is connected to the front and rear movement guide rail 7 through the slider 8, and the translation shaft 6 and the front and rear movement guide rail 7 respectively pass through The transmission mechanism is connected with the motor.

Embodiment 2

[0015] Embodiment 2, a grinding and polishing method for an ultra-long ultra-thin quartz plate, which uses the grinding and polishing machine described in Embodiment 1; before polishing, the workpiece 3 to be ground is installed in the workpiece placement groove set on the sleeve mold 1 , and the lower surface of the workpiece 3 to be ground protrudes from the workpiece placement groove of the mold 1 by 0.5 mm, and the width of the workpiece placement groove is 0.2 mm wider than the workpiece 3 to be ground; during processing, the grinding disc 4 rotates, and the translation shaft 6 or the forward and backward movement guide rail 7 Driven by the motor, it moves forward, backward, left or right, thereby driving the mold 1 and the workpiece 3 to be ground to move forward, backward, left or right.

Embodiment 3

[0016] Embodiment 3, a grinding and polishing method for an ultra-long and ultra-thin quartz plate, which uses the grinding and polishing machine described in Embodiment 1; before polishing, the workpiece 3 to be ground is installed in the workpiece placement groove set on the sleeve mold 1 , and the lower surface of the workpiece 3 to be ground protrudes from the workpiece placement groove of the mold 1 by 0.8 mm, and the width of the workpiece placement groove is 0.5 mm wider than the workpiece 3 to be ground; during processing, the grinding disc 4 rotates, and the translation shaft 6 or the forward and backward movement guide rail 7 Driven by the motor, it moves forward, backward, left or right, thereby driving the mold 1 and the workpiece 3 to be ground to move forward, backward, left or right.

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Abstract

The invention discloses a machine for grinding and polishing an ultra-long and ultra-thin quartz plate, which comprises a grinding disc. A cover die is arranged above the grinding disc; a workpiece placing slot is arranged on the cover die; the bottom of the workpiece placing slot is provided with a gasket; the cover die is fixedly connected on a translational shaft by a connecting rod; the translational shaft is connected with a guide rail which moves back and forth through a sliding block; and the translational shaft and the guide rail are connected with a motor respectively through a transmitting mechanism. The invention further discloses a process for grinding and polishing the ultra-long and ultra-thin quartz plate. The machine is suitable for grinding the ultra-long and ultra-thin quartz plate, is convenient to use, has a more reasonable structure, strong applicability and high use efficiency and can guarantee the quality and the rate of finished products effectively. The process for grinding and polishing the ultra-long and ultra-thin quartz plate is easy to operate and can guarantee the rate of finished products and the production efficiency.

Description

technical field [0001] The invention relates to a grinding and polishing machine for a quartz plate, in particular to a grinding and polishing machine suitable for an ultra-long and ultra-thin quartz plate. The invention also relates to a grinding and polishing method for an ultra-long and ultra-thin quartz plate. Background technique [0002] At present, the domestic quartz glass grinding and polishing technology, whether it is the classical polishing method or the quasi-spherical polishing method, is that the mirror disc and the grinding disc rotate in opposite directions and the mirror disc swings on the grinding disc with a certain trajectory. This principle of grinding and polishing mechanical movement has continued from the beginning to the present, and various types of plane grinding and polishing equipment are also manufactured according to this principle. Nowadays, it is the development trend to increase the size of the two discs, increase the spindle speed, continu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/04B24B37/27
Inventor 李振启蔡桂芳费立格霍永英刘梦云王晓东
Owner 蔡桂芳
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