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Adjustable capacitor, plasma impedance matching device, plasma impedance matching method, and substrate treating apparatus

A technology for substrate processing and impedance matching, which is applied in the direction of plasma, multi-connected capacitors, capacitors that change the distance between electrodes, etc., and can solve problems such as difficult impedance matching

Active Publication Date: 2012-07-11
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, it is difficult to perform impedance matching quickly

Method used

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  • Adjustable capacitor, plasma impedance matching device, plasma impedance matching method, and substrate treating apparatus
  • Adjustable capacitor, plasma impedance matching device, plasma impedance matching method, and substrate treating apparatus
  • Adjustable capacitor, plasma impedance matching device, plasma impedance matching method, and substrate treating apparatus

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Embodiment Construction

[0055]The present invention is further fully described below with reference to the accompanying drawings showing embodiments of the invention. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. In this application, the same reference numerals refer to the same elements

[0056] It will be understood that although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, Layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or se...

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Abstract

Disclosed is a substrate treating apparatus which comprises a process chamber; an electrode configured to generate plasma from a gas supplied into the process chamber; an RF power supply configured to output an RF power; a transmission line configured to transmit the RF power to the electrode from the RF power supply; an impedance matching unit connected to the transmission line and configured to match plasma impedance; and a controller configured to output a control signal to the impedance matching unit, wherein the impedance matching unit comprises an adjustable capacitor having a plurality of capacitors and a plurality of switches corresponding to the plurality of capacitors, the plurality of switches being switched on / off according to the control signal so that capacitance of the adjustable capacitor is adjusted.

Description

[0001] Cross References to Related Applications [0002] Pursuant to 35 U.S.C §119, Korean Patent Application No. 10-2010-0139483 filed on December 30, 2010 and Korean Patent Application No. 10-2011-0042697 filed on May 4, 2011 priority of the applications, which are incorporated by reference in their entirety into this application. Background technique [0003] The present invention described herein relates to an adjustable capacitor, a plasma impedance matching device, a plasma impedance matching method, and a substrate processing equipment, and more particularly, to an adjustable capacitor capable of adjusting capacitance, capable of using plasma in semiconductor manufacturing equipment A plasma impedance matching device for matching plasma impedance in body processing equipment, a plasma impedance matching method and substrate processing equipment. [0004] The plasma impedance matching device uses a radio frequency (RF, Radio Frequency) power source, and it is an impedan...

Claims

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Application Information

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IPC IPC(8): H01J37/32H05H1/46H01G5/38
CPCH01G5/16H05H2001/4682H05H1/46H01J37/32174H01J37/32091H01J37/32183H01J37/321H05H2242/26
Inventor 孙德铉
Owner SEMES CO LTD
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