Multi-layer circuit board and electrostatic discharge protection structure

Abstract

The present invention discloses a multi-layer circuit board and an electrostatic discharge protection structure, comprising a first insulating layer, a patterned conductive layer, an electrostatic releasing layer and a welded cover layer, wherein the first insulating layer is provided with a first surface, a second surface and a through hole; the patterned conductive layer is located on the first surface and at least partially encloses the periphery of the through hole; the electrostatic releasing layer is located on the second surface, is at least partially located at the periphery of the through hole, and is electrically insulated with the patterned conductive layer; and the welded cover layer covers the first insulating layer and the patterned conductive layer and enables the portion enclosing the through hole, of the patterned conductive, to be exposed. Furthermore, the present invention provides the multi-layer circuit board, comprising a second insulating layer, a power supply layer, a third insulating and the electrostatic discharging protection structure.

Description

technical field [0001] The invention relates to a multilayer circuit board, in particular to a multilayer circuit board with an electrostatic discharge protection structure. Background technique [0002] Electrostatic discharge (ESD) is often the main cause of damage to integrated circuits (ICs) during or after they are manufactured. Taking the electronic components assembled on the printed circuit board as an example, electrostatic discharge usually causes damage to the electronic components (such as chips) on the printed circuit board. Therefore, the integrated circuit itself usually needs to have the function of electrostatic protection, so as to prevent it from being damaged by external electrostatic current. In addition to the integrated circuit itself needing to have the function of electrostatic protection, printed circuit boards (Printed Circuit Board, PCB) in the process of production and assembly, are usually touched by the hands of workers, other printed circuit ...

AI Technical Summary

Problems solved by technology

In the case of strong destructive electrostatic discharge, even a transient voltage suppressor (TVS) or a current limiting diode (Zener Diode) can be connected in parallel to limit the current. However, the transient voltage suppressor and the current limiting The use of diodes will not only increase the complexity of the circuit, but also increase the manufacturing cost

In addition, the use of transient voltage suppressors and current limiting diodes goes against the trend of smaller and smaller board designs

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