Computing method of storage dynamic reliability for aviation drive circuit module

Abstract

Disclosed is a computing method of storage dynamic reliability for an aviation drive circuit module. The computing method includes steps of selecting, classifying and statistically analyzing main storage environmental stress; determining storage failure modes and failure mechanisms of the aviation drive circuit module; statistically analyzing storage environmental stress magnitudes; obtaining environmental test data of a component or a part on the premise that the failure mechanisms remain unchanged while the test environmental stress changes; computing life distribution characteristic parameters of various failure mechanisms in the module storage process; computing the life distributions of various failure mechanisms in the whole storage period; and obtaining an expression of the life distributions due to the life distribution characteristic parameters are known, integrating life distribution functions of various failure mechanisms in the storage period to obtain a failure probability F p (t) and a R p(t) reliability of various failure mechanisms at various times. According to the computing method of the storage dynamic reliability for the aviation drive circuit module, a more precise assessment result can be obtained on the premise of saving of test costs, and evidence can be provided for the reliability design of the aviation drive circuit module.

Description

technical field [0001] The invention provides a storage dynamic reliability calculation method of an aviation drive circuit module, in particular relates to a component storage failure probability calculation method based on a stress-life distribution relationship, and belongs to the technical field of reliability assessment based on failure physics. Background technique [0002] Storage refers to the state in which the product is stored under non-working conditions. Many long-term storage, one-time use devices, such as missiles, the components in their electronic equipment may fail due to various reasons or mechanisms after long-term storage environment, for example, parameter drift due to aging, due to changes in storage temperature. The exposure of internal defects of the chip, etc. [0003] At present, there are two ways to evaluate the storage reliability of electronic components commonly used in engineering. One is to use the non-working state reliability prediction m...

AI Technical Summary

Problems solved by technology

The problem with the manual method is that it assumes that the failure rate of components obeys an exponential distribution, which is not in line with engineering practice

Through the failure physical model, the storage life of components can be evaluated, but the storage failure probability cannot be calculated, and the dynamic reliability cannot be obtained.

Through the novelty search and retrieval of existing technologies, there is no method at home and abroad to use the stress-life distribution relationship to determine the storage failure mechanism of components and use foreign reliability test databases to calculate the dynamic reliability of aviation drive circuit modules.

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