Unlock instant, AI-driven research and patent intelligence for your innovation.

FPC high density circuit board convenient for being tested and test method thereof

A test method and circuit board technology, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve problems such as inability to test high-density products

Inactive Publication Date: 2012-07-18
博罗县精汇电子科技有限公司
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides an FPC circuit board which is convenient for testing and a testing method for the circuit board, and solves the technical problem that it is impossible to test high-density products in the prior art by using a combination of conductive glue and test needles to lead out the test line

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • FPC high density circuit board convenient for being tested and test method thereof
  • FPC high density circuit board convenient for being tested and test method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0008] Specific embodiments of the present invention are described with reference to the above drawings.

[0009] Depend on figure 1 As can be seen in the figure, this FPC high-density circuit board that is convenient for testing includes a substrate 10, a conductive wire group 20 arranged on the substrate, at least part of the conductive wire group 20 has test wires 21 extending on the conductive wires, the described The test line 21 extends into the substrate cutting area 30 .

[0010] This test method for the above-mentioned FPC high-density circuit board that is convenient for testing comprises the following steps: A. first lay conductive adhesive strip 40 on the conductive wire group 21 on the FPC high-density circuit board, and conductive adhesive strip 40 connects conductive wire group 20 The conductive wire 22 on the surface of the base material; B. test the open and short circuit performance of the conductive wire connected by the conductive adhesive strip 40 with a ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A FPC high density circuit board convenient for being tested comprises a base material (10) and a conductive line set (20) arranged above the base material. A test line (21) is extended on at least parts of the conductive lines in the conductive line set (20). The test line (21) is extended to a base material cutting area (30). By using the above technical scheme of the invention, problems of a high density production board needle stamp, a conducting resin leakage point and a blind spot during a test process can be effectively solved.

Description

technical field [0001] The invention relates to circuit board design, in particular to the structural design and testing method of the FPC circuit board. Background technique [0002] At present, there are two methods for testing FPC circuit open and short circuit in the industry: 1: It is a test pin test. 2: Use conductive glue to test. These two methods have the disadvantages of easily causing needle marks on the surface of parts and blind spots, and are not suitable for testing high-density products. Contents of the invention [0003] The invention provides an FPC circuit board which is convenient for testing and a testing method for the circuit board, and solves the technical problem that it is impossible to test high-density products in the prior art by using a combination of conductive glue and test needles to lead out the test line . [0004] The FPC high-density circuit board that is convenient for testing provided by the present invention to solve the above-ment...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02G01R31/02
Inventor 叶夕枫
Owner 博罗县精汇电子科技有限公司