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Grinding pad as well as producing method and using method therefor

A technology of grinding pads and abrasive blocks, which is applied in the direction of grinding tools, grinding/polishing equipment, abrasives, etc., can solve the problems of wafer scrapping, over-grinding, and insufficient wafer grinding, and achieve stable grinding rate, easy and precise control, The effect of improving the grinding effect and yield

Active Publication Date: 2012-07-25
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The problem solved by the present invention is to provide a polishing pad and its preparation method and use method, which can solve the problem that the existing polishing pad cannot maintain a balanced wafer polishing rate, and the problem of insufficient or over-grinding of the wafer is prone to occur, resulting in the scrapping of the wafer

Method used

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  • Grinding pad as well as producing method and using method therefor
  • Grinding pad as well as producing method and using method therefor
  • Grinding pad as well as producing method and using method therefor

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Embodiment Construction

[0028] like image 3 As shown, the inventors found that in the existing fixed abrasive grinding method, the grinding pad is composed of a base and an abrasive layer; the abrasive layer is consolidated on the base 201, and a three-dimensional structure with a specific shape is formed by mixing and pressing the abrasive particles and the resin binder Abrasive blocks 202, wherein the abrasive grains are wrapped in a resin adhesive; all the abrasive blocks in the abrasive block 202 are of the same height, that is, the abrasive blocks 202 have only one height. like Figure 4 As shown, during the grinding process, the resin adhesive 2021 dissolves under the action of the grinding liquid, so that the uppermost abrasive grains 2022 are exposed and contact with the surface of the wafer 203 to play the role of grinding the wafer 203; Continuously, the resin adhesive 2021 is further dissolved, and the uppermost abrasive particles 2022 are gradually separated from the resin adhesive 2021...

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Abstract

A grinding pad comprises a base and a plurality of independent abrasive blocks solidified on the base, wherein the abrasive blocks have at least two kinds of height. According to the grinding pad, with the adoption of the abrasive blocks with at least two kinds of height, the grinding speed of the grinding pad is not reduced greatly due to the long-time grinding in the process of grinding a wafer, so that the grinding degree of the wafer is easily controlled accurately, and the grinding effect and the grinding yield of the wafer are improved. The invention also provides a method for producing the grinding pad, and the grinding pad can be conveniently produced by the method. Correspondingly, the invention also provides a using method which adopts the grinding pad for grinding.

Description

technical field [0001] The invention relates to a semiconductor manufacturing process, in particular to a grinding pad and its preparation method and usage method. Background technique [0002] In the semiconductor manufacturing process, a flat wafer surface is extremely important for the miniaturization and high density of devices. The traditional method of flattening the wafer surface is chemical mechanical polishing (CMP). In this method, a polishing liquid is added between the wafer surface and the polishing pad, and the surface of the wafer is planarized by utilizing the action of mechanical force and the chemical reaction between the polishing liquid and the surface of the wafer. Due to the random distribution of the polishing liquid in the chemical mechanical polishing method, the density is not uniform, the grinding effect is relatively poor, and the utilization rate of the polishing liquid is low, and the waste liquid of the polishing liquid is easy to pollute the e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D13/14B24D18/00
CPCB24D18/00B24D13/14B24B37/16
Inventor 邵群
Owner SEMICON MFG INT (SHANGHAI) CORP