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Piezoelectric micro-dissection system, dissection depth positioning method and dissection method

A technology of microdissection and cutting depth, applied in the field of biomedicine, which can solve the problems of low efficiency, inability to realize automatic cutting, and inconvenient use.

Inactive Publication Date: 2012-07-25
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] There are also some piezoelectric ultrasonic microdissection devices in China, but none of them can achieve fully automatic cutting with controllable cutting depth direction, which is inconvenient to use, low in efficiency, and cannot guarantee the best cutting effect. Can not control

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  • Piezoelectric micro-dissection system, dissection depth positioning method and dissection method
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  • Piezoelectric micro-dissection system, dissection depth positioning method and dissection method

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Embodiment Construction

[0040] The purpose of the present invention is to provide a piezoelectric microdissection system to overcome the defects that the operator's work intensity is high, difficult to implement, time-consuming, easy to fatigue, and human error is inevitable when cutting and separating biological tissue slices manually. Compared with the existing piezoelectric cutting system, the microdissection system designed by the present invention can be automatically positioned at any position in the depth direction of the desired cut tissue slice, and can automatically complete the cutting of the target tissue slice, using cutting needles of different thicknesses It can realize the cutting of areas of different sizes, and can complete the cutting of specific tissue slices smaller than 10um×10um area at the minimum (capable of cutting at the cell level), and can realize the separation of target tissue slices.

[0041] In order to further understand the present invention, the preferred embodiment...

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Abstract

The invention provides a piezoelectric micro-dissection system, which comprises a platform, a vibratory dissection portion, a first electric manipulator, a needle holder, a second electric manipulator, an image acquisition system and a computer system. The invention further provides a dissection depth positioning method and a dissection method. The piezoelectric micro-dissection system can be automatically positioned at an optional position of a biological tissue required to be dissected in a depth direction, can automatically dissect the objective biological tissue, and further can realize separation of slices of the objective tissue.

Description

technical field [0001] The invention belongs to the technical field of biomedicine, and in particular relates to a piezoelectric micro-cutting system, a cutting depth positioning method and a cutting method. Background technique [0002] Microdissection technology is to cut and separate the materials to be selected (tissues, cell groups, cells, intracellular components or chromosomal bands, etc.) through a microscopic operating system under a microscopic state or under direct vision of a microscope and collect them for subsequent use. Research technology. Its characteristic is that a specific kind of cell or a single cell can be obtained from a complex tissue. It has a wide range of applications in specific cell cutting in molecular biology, specific chromosome cutting in cytogenetics, gene detection in tumor disease pathology, etc. Microdissection and separation technology has broadened the field and precision of genomics research, provided irreplaceable help to the devel...

Claims

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Application Information

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IPC IPC(8): G01N1/04
Inventor 汝长海朱猛
Owner SUZHOU UNIV