Buffering element and bonding method for flip-chip soft film using the same

A buffer element and bonding method technology, applied in the field of buffer elements, can solve problems such as insufficient thermal expansion of flip-chip soft film, too large, and errors

Inactive Publication Date: 2012-07-25
AU OPTRONICS CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Although the above-mentioned hot pressing process of the chip-on-chip soft film can achieve the purpose of corresponding electrical connection, but in practice, the temperature of the chip-on-chip soft film is not easy to control. When the temperature does not fall within the predetermined range, the chip-on-chip soft film The amount of thermal expansion will be insufficient or excessive, poor or wrong electrical connection
In addition, in the actual process, the aforementioned buffer material is arranged between the thermal head and the flip-chip soft film, so that the temperature of the flip-chip soft film will be more difficult to control, and it is easier to form a bad electrical connection

Method used

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  • Buffering element and bonding method for flip-chip soft film using the same
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  • Buffering element and bonding method for flip-chip soft film using the same

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Embodiment Construction

[0039] The detailed features and advantages of the present disclosure are described in detail below in the embodiments, the content of which is sufficient for any person familiar with the relevant art to understand the technical content of the present disclosure and implement it accordingly, and according to the contents disclosed in this specification, claims and drawings, Objects and advantages related to the present disclosure can be easily understood by anyone skilled in the art.

[0040] First, please refer to figure 1 , which is a structural schematic diagram of a buffer element according to an embodiment of the present disclosure. The buffer sheet 10 is suitable for a chip on film process. please match Figure 2A read. from Figure 2A It can be seen that the cushioning element 10 is wound on the rollers 52a, 52b in the Flip-chip soft film process, and the rollers 52a, 52b are respectively arranged in the cassettes (Buffer Sheet Cassette) 50a, 50b on both sides of th...

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Abstract

The invention provides a buffering element and a bonding method for a flip-chip soft film using the same, wherein the buffering element applied to the flip-chip soft film is bonded with a substrate. The buffering element comprises a first film layer, a thermal resistance layer and a second film layer sequentially contraposed with each other. The thermal conduction coefficient of the thermal resistance layer is lower than that of the first film layer and the second film layer. Therefore, when a pressing head does not press against the flip-chip soft film, a large amount of heat is interdicted by the buffering element. When the pressing head presses against the flip-chip soft film, the heat of the pressing head can be quickly conducted to the flip-chip soft film for heating thermally conductive adhesive material arranged between the flip-chip soft film and the substrate.

Description

technical field [0001] The invention relates to a buffer element, in particular to a buffer element applied to flip-chip soft film bonding and a bonding method thereof. Background technique [0002] Generally speaking, the method of joining the chip on film (Chip on Film) to the liquid crystal panel is mostly a hot pressing process. In the hot pressing process, the chip on film is first stacked on the liquid crystal panel, and then hot pressed The head presses against the soft flip chip film, so the adhesive material between the soft flip chip film and the LCD panel will glue the soft flip chip film and the LCD panel together. In addition, during the aforementioned pressing process, the thermal head usually presses against the flip-chip soft film through a buffer material. [0003] In the above-mentioned hot-pressing process, the wiring of the liquid crystal panel and the outer lead of the chip of the flip-chip soft film need to complete the corresponding electrical connect...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L21/60
Inventor 罗楚俊
Owner AU OPTRONICS CORP
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