Rotationally decoupling two-degree freedom leveling mechanism

A technology of leveling mechanism and degrees of freedom, applied in the directions of manipulators, program-controlled manipulators, electrical components, etc., can solve the problems of slow loading of chips, long time required for leveling, etc., to achieve good dynamic effects, good motion performance, and bearing capacity. strong effect

Active Publication Date: 2012-08-01
HUAZHONG UNIV OF SCI & TECH
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The principle of this method is very simple, but the force on the chip must be applied slowly to ensure the leveling effect, and the time required for leveling is relatively long

Method used

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  • Rotationally decoupling two-degree freedom leveling mechanism
  • Rotationally decoupling two-degree freedom leveling mechanism

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Embodiment Construction

[0009] Such as figure 1 As shown, the leveling mechanism of the present invention mainly includes a fixed platform 1, a moving platform 2 and three branches connected between the two platforms. Wherein the first branch only includes a cross universal joint 6, and the two ends of the cross universal joint 6 are respectively connected with the fixed platform 1 and the moving platform 2 through rotating pairs, and the axes of the two rotating pairs are in different planes. The second branch is formed by connecting the rotating guide rail 3, the slide block 4 and the crank connecting rod 5 successively. Wherein the rotating guide rail 3 is connected with the fixed platform 1 through a rotating pair, and the axis of the rotating pair is collinear with the axis of the rotating pair connected with the cross universal joint 6 and the fixed platform 1; the slide block 4 is connected with the rotating guide rail 3 through a moving pair The moving direction of the moving pair is not par...

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Abstract

The invention provides a rotationally decoupling two-degree freedom leveling mechanism. The leveling mechanism comprises a fixed platform, a movable platform and three branches connected between the two platforms, wherein only one cross universal joint of the first branch is connected with the fixed and the movable platforms; a sliding pair between a rotating guide rail and a slide block in the second branch is a driving pair, the slide block moves linearly to drive a crank link to rotate, so as to further drive the movable platform to rotate around the axis of a rotating pair between the cross universal joint and the movable platform; and a sliding pair between a rotating guide rail and a slide block in the third branch is also a driving pair, and the slide block linearly moves to drive another crank link to rotate, so as to drive the movable platform to rotate around the axis of another rotating pair between the cross universal joint and the fixed platform. The rotationally decoupling two-degree freedom leveling mechanism has a simple structure; owing to complete decoupling of two rotation movements of the movable platform, the movement performance is favorable and the control is easy; the operating space is larger; the processing and assembling performance is good; and favorable practicability is achieved.

Description

technical field [0001] The invention relates to the field of electronic packaging, in particular to a rotationally decoupled two-degree-of-freedom leveling mechanism. Background technique [0002] IC packaging is mainly to install the IC chip on the substrate, realize the electrical connection between the chip and the substrate, and play the role of fixing, sealing, protecting the chip and enhancing the electrical performance. With the development of IC packaging in the direction of miniaturization and thinning, flip-chip bonding technology has become the mainstream process technology for advanced IC packaging. It has the advantages of short connection, high connection density and simple process. It is widely used in large-capacity memory, CPU Packaging of high-end chips such as chips. IC chips using flip-chip bonding have the characteristics of large area and many bumps (or solder balls). When performing flip-chip bonding, the chip must be parallel to the substrate to ensu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50B25J9/08
Inventor 尹周平蔡伟林熊涛熊有伦
Owner HUAZHONG UNIV OF SCI & TECH
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