Double-bending reverse bank type light-emitting diode (LED) packaging structure and packaging technology thereof
A technology of LED encapsulation and wire arc type, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of shortened service life, disconnection, drop-out, failure to meet customer requirements, etc., to improve reliability and enhance integration force effect
Inactive Publication Date: 2012-08-01
LEDMAN OPTOELECTRONICS
View PDF3 Cites 8 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] However, limited to its structure and packaging process, the existing LED light-emitting chips still face the problem of failure in the application process. The main reason is that the connecting wires of the packaged chip structure are prone to disconnection and detachment due to the inability to withstand internal stress. point, causing dead lights to fail, and eventually lead to shortened service life, which cannot meet customer requirements and is not conducive to the promotion of environmental protection and energy saving, especially in the outdoor application process. Such problems are particularly serious. It can be said that to a large extent The use of LED lights has formed limitations
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0026] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.
[0027] see Figure 1-4 , the present invention is a kind of doubles anti-arc type LED package structure, it comprises chip 1, substrate 4, first wire 6, second wire 8, first metal ball 5, second metal ball 7, third metal ball 3 and thread neck.
[0028] Wafer 1 upper surface is provided with wafer electrode 2, and wherein, the 3rd metal ball 3 covers on the wafer electrode 2 surface, preferably the 3rd metal ball 3 should not exceed the wafer electrode 2 surface, the best 3rd metal ball 3 covers wafer The area of 80%-100% of the surface of electrode 2, namely Figure 1-4 The relationship between R1 and R2 in: 80%≤R1 / R2≤100%. In addition, the welding quality can be ensured by controlling the thickness H1 of the third metal ball 3. The ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a double-bending reverse bank type LED packaging structure and a packaging technology thereof. A weak stress point on a base material is transferred to a wafer through adopting a wafer electrode and a structure that the sides of a substrate are respectively provided with a first metal ball, a second metal ball, a third metal ball, a first lead connection and a second lead connection, simultaneously, a small bank is additionally welded onto a welding spot of the base material, binding force between the metal and the weak stress point of the base material is further enhanced, and reliability of the product is improved.
Description
technical field [0001] The invention relates to an LED structure and a manufacturing process, in particular to a double-play reverse-arc LED packaging structure and a packaging process. Background technique [0002] As a new type of light source, LED is widely used in buildings, solar street lights, flashlights, car lights, table lamps, backlights, display screens, spotlights, gardens, etc. , wall lamps, small area decorative lighting for home, and commercial lighting integrating decoration and advertising. [0003] However, limited to its structure and packaging process, the existing LED light-emitting chips still face the problem of failure in the application process. The main reason is that the connecting wires of the packaged chip structure are prone to disconnection and detachment due to the inability to withstand internal stress. point, causing dead lights to fail, and eventually lead to shortened service life, which cannot meet customer requirements and is not conduc...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L24/48H01L2224/32245H01L2224/48465H01L2224/48471H01L2224/48479H01L2224/4848H01L2224/49429H01L2224/73265H01L2924/19107H01L2224/451H01L2924/12041H01L2224/49H01L2224/48H01L2924/00014H01L2224/48247H01L2924/00H01L2924/00012H01L2224/4554
Inventor 李漫铁王绍芳孟牧冯珍
Owner LEDMAN OPTOELECTRONICS