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Novel fixing device and assembling method for high-power radio frequency power amplifiers

A technology of radio frequency power and fixing devices, which is applied in the directions of elastic/clamping devices, circuit layout on support structures, cooling/ventilation/heating transformation, etc., which can solve problems such as inflexibility, structural design shape restrictions, and high cost of device procurement. Achieve the effects of life enhancement, avoid contact surface oxidation, and simple structure

Active Publication Date: 2012-08-01
北京市万格数码通讯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is dedicated to the power amplifier module, the cost of component procurement is high, and the structural design is limited by the shape of the power amplifier module, so it is not flexible

Method used

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  • Novel fixing device and assembling method for high-power radio frequency power amplifiers
  • Novel fixing device and assembling method for high-power radio frequency power amplifiers
  • Novel fixing device and assembling method for high-power radio frequency power amplifiers

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Embodiment Construction

[0039] figure 1 Shown is a schematic structural diagram of an existing RF power amplifier 2 , which includes a central RF power amplifier body, input and output pins 21 and 22 and ground pins 23 and 24 .

[0040] figure 2 The structure of an embodiment of the radio frequency power amplifier fixing device of the present invention is shown, and a schematic diagram of the corresponding position of the radio frequency power amplifier on the PCB is also given in the figure. In this embodiment, the RF power amplifier fixing device is mainly composed of a heat dissipation base 6, a PCB board 3 and a fixing unit device 1, and the fixing unit device 1 is made up of at least one pair of adjustment bolt groups (each group consists of a bolt 5 and a group of adjustment protection fixing Position 4) is connected with PCB board 1. The input and output pins of the RF power amplifying tube 2 are respectively welded on the input and output pads of the PCB board 3. The reference numeral 24 i...

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PUM

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Abstract

The invention discloses a novel fixing device and an assembling method for high-power radio frequency power amplifiers. The fixing device comprises a radiating base, a PCB (printed circuit board) board and a U-shaped piece. The PCB board is arranged tightly on the upper surface layer of the radiating base and provided with a center hole and a pair of fixing holes for connecting, a group of welding pads are arranged along the surrounding edge of the center hole; the central part of the U-shaped piece is an arc-shaped groove body, the upper two sides extend outward to form lugs respectively, each lug is provided with a fixing hole and is connected with the PCB board through an adjusting protection retaining part and a screw which penetrates through the fixing hole;a high-power radio frequency power amplifier is pressed on the radiating base by the central arc-shaped groove body of the U-shaped piece through downward pressure; and the U-shaped piece, the PCB board and the radiating base are connected by the screws or bolts which penetrate through the fixing holes on the lugs. By the assembling method, the high-power radio frequency power amplifiers can be assembled with low cost, good grounding and radiating of the radio frequency amplifiers can be guaranteed, performance consistency of the high-power radio frequency power amplifiers is improved, and production and assembly of the high-power radio frequency power amplifiers are facilitated.

Description

technical field [0001] The present invention relates to the field of communication equipment, and more particularly, to an installation device for a radio frequency power amplifier of communication equipment and a method for realizing installation using the same. Background technique [0002] The RF power amplifier is an important part of various wireless transmitters. In the transmission system, the output power of the RF power amplifier can be as large as several hundreds of watts. Therefore, the grounding impedance and heat dissipation effect of the RF power amplifier determine the reliability and cost of the entire amplifier, and its installation and fixing methods are extremely critical. [0003] The RF power amplifier uses a special power amplifier module, which guarantees the grounding effect and heat dissipation performance, but the cost is high, and each special RF power amplifier module requires a specific installation structure to cooperate, which brings great adv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/12H05K7/20
Inventor 孙红业梁燕生韦天德
Owner 北京市万格数码通讯科技有限公司
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