Gas distribution drying furnace

Abstract

The invention discloses a gas distribution drying furnace, which comprises a furnace body and a furnace cavity, wherein the furnace body is provided with a drying passage, a plurality of groups of heat insulation plates are arranged in the furnace cavity, each group of the heat insulation plates comprises a first heat insulation plate and a second heat insulation plate, the first heat insulation plate is connected with the top wall, the second insulation separation plate is connected with the bottom wall, a first gas distribution plate is arranged between every two adjacent first heat insulation separation plates, the top wall is provided with a plurality of first gas inlet, one side of each first gas inlet is respectively provided with a first temperature control device, a second gas distribution plate is arranged between every two second heat insulation plates, the bottom wall is provided a plurality of second gas inlets, one side of each second gas inlet is respectively provided with a second temperature control device, a heating device is arranged on the side wall, two ends of the top wall are respectively provided with gas outlets, an exhausting device is arranged above each gas outlet, and oil storage grooves are arranged in the exhausting devices. The gas distribution drying furnace disclosed by the invention has the advantages that the structure is simple, the cost is lower, the service life is longer, and the constant temperature drying can be realized.

Description

technical field [0001] The invention relates to a drying furnace in the solar silicon wafer industry, in particular to a gas distribution drying furnace which regulates temperature through air flow. Background technique [0002] The drying of silicon wafers in the solar silicon wafer industry is a very important step in the entire production process of solar silicon wafers. The silicon wafer passes through a drying furnace channel at a certain temperature, so that the paste printed on both sides of the silicon wafer can remove water and other oily substances, so that useful materials can be evenly and firmly attached to the silicon wafer. Among them, the uniformity and stability control of the drying temperature during the drying process is very important. Whether the constant temperature drying can be guaranteed during the entire drying process has a great influence on the quality of the silicon wafer. Moreover, oily substances such as water vapor produced during the dryin...

AI Technical Summary

Problems solved by technology

The drying furnace in the prior art has relatively high power, high cost, and short service life, and cannot deal with the influence of condensation and dripping of oily substances evaporated during the drying process on silicon wafers.

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