Manufacturing method of component baseplate

A component substrate and manufacturing method technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of laser regulation ability affecting yield, production capacity, and production cost increase

Active Publication Date: 2015-07-01
INNOCOM TECH (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, once the size of the glass substrate and plastic substrate increases, the control capability of the laser will greatly affect the yield and production capacity, which will significantly increase the production cost

Method used

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  • Manufacturing method of component baseplate
  • Manufacturing method of component baseplate
  • Manufacturing method of component baseplate

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0044] Please refer to Figure 2A ~ Figure 2E , which shows a schematic flow chart of a first manufacturing method of an element substrate according to a first embodiment of the present invention. Figure 2A and Figure 2B corresponds to figure 1in step S101, and Figure 2C ~ Figure 2E corresponding to figure 1 Step S103 to step S107 in. It will be described in detail below.

[0045] pass Figure 2A and Figure 2B The carrier 110 provided in the process has a first surface 111s1 and a second surface 112s2, and the second surface 112s2 is located around the first surface 111s1.

[0046] exist Figure 2A In this example, a carrier board 111 is provided, and the carrier board 111 has a first surface 111s1.

[0047] Next, at Figure 2B In the process, the patterned release structure 112 is formed on the first surface 111s1 of the carrier 111 to form the carrier 110 . The release structure 112 has a second surface 112s2. The release structure 112 here can be, for exampl...

no. 2 example

[0059] Please refer to Figure 4A ~ Figure 4E , which is a schematic flowchart of a method for manufacturing an element substrate according to a second embodiment of the present invention. Compared with the second method of manufacturing the element substrate 100 of the first embodiment, the method of manufacturing the element substrate 200 of this embodiment roughens the surface in different ways to change the adhesion of the surface. Figure 4A and Figure 4B corresponds to figure 1 in step S101, and Figure 4C ~ Figure 4E corresponding to figure 1 Step S103 to step S107 in. It will be described in detail below.

[0060] pass Figure 4A and Figure 4B The carrier 310 provided in the process has a first surface 311s1 and a second surface 311s2, and the second surface 311s2 is located around the first surface 311s1.

[0061] exist Figure 4A In this example, a carrier board 311 is provided, and the carrier board 311 has a first surface 311s1.

[0062] Next, at Figu...

no. 3 example

[0067] Please refer to Figure 5A ~ Figure 5E , which shows a schematic flowchart of a method for manufacturing an element substrate according to a third embodiment of the present invention. Compared with the first manufacturing method of the element substrate 100 in the first embodiment, the arrangement position and material of the release structure 412 in this embodiment are different. Figure 5A and Figure 5B corresponds to figure 1 in step S101, and Figure 5C ~ Figure 5E corresponding to figure 1 Step S103 to step S107 in. It will be described in detail below.

[0068] pass Figure 5A and Figure 5B The carrier 410 provided in the process has a first surface 412s1 and a second surface 411s2, and the second surface 411s2 is located around the first surface 412s1.

[0069] like Figure 5A As shown, a carrier 411 is provided having a second surface 411s2.

[0070] Next, if Figure 5BAs shown, a patterned release structure 412 is formed on the second surface 411s2...

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Abstract

The invention discloses a manufacturing method of a component baseplate. The manufacturing method comprises following steps of: providing a load-bearing piece, wherein the load-bearing piece is provided with a first surface and a second surface, and the second surface is positioned on the periphery of the first surface; subsequently, forming a material layer on the load-bearing piece, wherein a part of the material layer covers the first surface, and the other part of the material layer covers the second surface, and the adhesive force between the material layer and the second surface is greater than the adhesive force between the material layer and the first surface; then, forming a component on the material layer; and carrying out cutting on the material layer along a cut line, and forming the component baseplate, wherein the component baseplate and the load-bearing piece are mutually separated.

Description

technical field [0001] The present invention relates to a manufacturing method of a component substrate, and in particular to a manufacturing method of a component substrate using bearings with different adhesion forces in the manufacturing process. Background technique [0002] With the rapid development of display technology, the use of monitors is very common. Because glass itself has good light transmission and load-bearing strength, most displays currently use glass as a substrate material in mass production. Light and thin is the future trend of displays. However, the specific gravity of the glass is relatively large, and in order to maintain the load-bearing strength and surface flatness, it must have a considerable thickness, so the glass substrate accounts for a considerable part of the overall weight of the display. At present, the industry mostly uses chemical etching or grinding to reduce the thickness and weight of the glass substrate, so as to make the displa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02
Inventor 蔡奇哲蒋承忠吴威谚林柏青陈正达
Owner INNOCOM TECH (SHENZHEN) CO LTD
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