Substrate for power module and manufacturing method, the substrate and power module with built-in heat sink
A technology of power modules and substrates, which is applied in the manufacture of semiconductor devices, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as interface peeling, and achieve the effect of preventing cracks
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[0099] A comparative experiment performed to confirm the effectiveness of the present invention will be described.
[0100] A 4N aluminum circuit layer with a thickness of 0.6 mm and a 4N aluminum metal layer with a thickness of 0.6 mm were joined to a ceramic substrate made of AlN with a thickness of 0.635 mm to produce a substrate for a power module.
[0101] Here, Cu and additive elements are fixed on the bonding surface of the aluminum plate (4N aluminum) to be the circuit layer and the metal layer to form an anchor layer, and the metal plate and the ceramic substrate are laminated and heated under pressure to join the metal plate and the ceramic substrate. .
[0102] Furthermore, various test pieces in which the added elements to be fixed were changed were produced, and the bonding reliability was evaluated using these test pieces. As an evaluation of bonding reliability, the bonding rate after repeating 2000 cycles of cooling and heating (-45°C to 125°C) was compared. ...
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