Glue discharging furnace

Abstract

The invention discloses a glue discharging furnace which comprises a furnace wall, a furnace door, a heart surrounded by the furnace wall and the furnace door, an air inlet, an air outlet, an air blower, a heater, an air inlet plate, an air outlet plate, a plurality of baffle plates and a plurality of air regulating plates, wherein the air inlet and the air outlet are arranged on the furnace wall; the air blower and the heater are positioned in the hearth; the air inlet plate and the air outlet plate are arranged in the hearth; the plurality of baffle plates are positioned between the air inlet plate and the air outlet plate and are used for placing to-be-discharged glue elements; the air inlet plate is provided with a plurality of air inlet holes; the air regulating plates are provided with a plurality of air regulating holes; the air regulating plates are installed on the air inlet plate and are fit with the air inlet plate so as to enable the air regulating holes and the air inlet holes to be staggered and overlapped; and the installation position of the air regulating plates on the air inlet plate can be regulated, thus the overlapped degree of staggered overlapping can be regulated. Compared with the prior art, the air speed of each layer of the glue discharging furnace provided by the invention can be regulated consistently, and the glue discharging effect is good.

Description

technical field [0001] The invention relates to a glue-removing technology for chip electronic components, in particular to a glue-removing furnace. Background technique [0002] Glue removal is an important process in the production of chip components, and the effect of glue removal directly affects the quality of chip components. Debinding furnaces in the industry often have shortcomings such as uneven air intake for each layer in the furnace and uneven temperature in the furnace. Due to these shortcomings, due to the different positions of the chip components in the debinding furnace, the extreme difference in the amount of debinding between them is often large, resulting in different final process performances of the products. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a debinding furnace to reduce the difference in air intake and temperature of each layer in the hearth of the debinding furnace. [000...

AI Technical Summary

Problems solved by technology

Debinding furnaces in the industry often have shortcomings such as uneven air intake for each layer in the furnace and uneven temperature in the furnace.

Due to these shortcomings, due to the different positions of the chip components in the debinding furnace, the extreme difference in the amount of debinding between them is often large, resulting in different final process performances of the products.

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