Modular data center

A data center, modular technology, applied in the direction of electrical digital data processing, digital data processing parts, instruments, etc., can solve the problems of low space utilization, complex engineering installation, low integration, etc., to achieve convenient installation and maintenance, Reasonable layout, solve the complex effect of engineering installation

Active Publication Date: 2015-04-15
HUAWEI TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In order to overcome the defects of low space utilization rate and low integration degree in the above-mentioned prior art, as well as the defects of complicated engineering installation and inconvenient maintenance, the embodiment of the present invention provides a modular data center

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Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0026] see figure 1 As shown, a modular data center according to an embodiment of the present invention includes a housing 10, a heat pipe evaporator module 22, a heat pipe condenser module 21, and a rack 30. The housing 10 is divided into The lower indoor area 12 and the upper outdoor area 13, the lower indoor area 12 is provided with a frame 30 and a heat pipe evaporator module 22, the back side of the frame 30 is provided with a heat pipe evaporator module 22, the heat pipe evaporator module 22 and the heat pipe condenser module 21 Connected, the heat pipe evaporator module 22 is used to transfer the heat generated by the equipment on the rack 30 to the heat pipe condenser module 21; the upper outdoor area 13 is provided with a heat...

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Abstract

Disclosed is a modular data centre, which belongs to the field of electronics. The modular data centre comprises a casing, a heat-pipe evaporator module, a heat-pipe condenser module and a rack. The casing comprises a lower indoor region and an upper outdoor region which are divided by a sealing baffle. The rack and the heat-pipe evaporator module are arranged in the lower indoor region, the back surface of the rack is provided with the heat-pipe evaporator module, the heat-pipe evaporator module is connected to the heat-pipe condenser module, and the heat-pipe evaporator module is used for transferring heat generated by a device on the rack to the heat-pipe condenser module. The heat-pipe condenser module is arranged in the upper outdoor region, the upper outdoor region is provided with an air inlet and an air outlet, and the heat-pipe condenser module conducts heat exchange with ambient air through the air inlet and the air outlet so as to achieve natural air cooling. The embodiments of the present invention have the advantages of a reasonable layout, a high space utilization rate and a high integration level, and reduce the energy usage using natural air cooling. The present invention can be applied to enable the data centre to be assembled in the factory without on-site installation, thereby having the advantages of convenient installation and maintenance.

Description

technical field [0001] The invention relates to a data center, in particular to a modular data center. Background technique [0002] Currently, data centers are usually located in computer rooms. Due to the need to consider the future business capacity when constructing and deploying a traditional civil data computer room, the initial construction needs to be in place at one time, resulting in high initial investment, but the energy utilization efficiency of the infrastructure in the initial stage of actual operation is low, and the scalability of the computer room in the later stage is poor. At present, as the equipment density and power in the computer room continue to increase, the transmission civil engineering data computer room cannot be expanded, resulting in the continuous increase in the cost of building and operating the data center for customers, and how to solve the energy efficiency of the data center and on-demand deployment has become a difficult problem in th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/16G06F1/20
CPCG06F1/20
Inventor 彭永辉
Owner HUAWEI TECH CO LTD
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