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Methods, structures and devices for increasing memory density

A memory and memory string technology, applied in semiconductor devices, electrical solid state devices, semiconductor/solid state device manufacturing, etc., can solve problems such as limiting the density of non-volatile memory cells

Active Publication Date: 2012-09-12
MICRON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional nonvolatile memory cells utilize a significant amount of real estate on the semiconductor substrate, and thus limit the density of nonvolatile memory cells

Method used

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  • Methods, structures and devices for increasing memory density
  • Methods, structures and devices for increasing memory density
  • Methods, structures and devices for increasing memory density

Examples

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Embodiment Construction

[0020] The illustrations presented herein are not intended to be actual views of any particular device or system, but are merely idealized representations used to describe the invention. Additionally, elements that are common between the various figures may retain the same numerical designation. It will be appreciated that for simplicity and clarity of illustration, reference numerals of elements that are common between the figures need not be shown in each of the figures.

[0021] Figure 1A and 1B An embodiment of a portion of a memory device 100 of the present invention is shown. Figure 1B yes Figure 1A The memory device 100 shown in is a cross-sectional view taken along section line 1-1 therein. Memory device 100 includes at least one memory string 102 with a plurality of diodes 104 electrically coupled to electrode 110 and spaced along the length of electrode 110 . The memory device 100 may be disposed on a conventional multi-gate memory device, such as a conventio...

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Abstract

Non-volatile memory devices comprising a memory string including a plurality of vertically superimposed diodes. Each of the diodes may be arranged at different locations along a length of the electrode and may be spaced apart from adjacent diodes by a dielectric material. The electrode may electrically couple the diodes of the memory strings to one another and to another memory device, such as, a MOSFET device. Methods of forming the non-volatile memory devices as well as intermediate structures are also disclosed.

Description

[0001] Related Application Cross Reference [0002] This application claims the filing date of U.S. Patent Application No. 12 / 610,922, "METHODS, STRUCTURES AND DEVICES FOR INCREASING MEMORY DENSITY," filed November 2, 2009 rights and interests. technical field [0003] Embodiments of the invention relate to methods, structures, and devices for increasing memory density, and more particularly to methods for forming multilayer semiconductor structures, as well as resulting structures and devices incorporating such structures. Background technique [0004] Non-volatile memory devices are used to store digital data for use in computer systems and other electronic devices. A nonvolatile memory does not change state immediately after the power applied to it is removed or fails, and thus the nonvolatile memory retains stored data even for subsequent search. Examples of nonvolatile memory cells include Magnetic Random Access Memory (MRAM), Ferroelectric Random Access Memory (FRA...

Claims

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Application Information

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IPC IPC(8): H01L27/115H01L21/8247
CPCH01L27/0207H10B63/20H10B63/30H10B63/845H10N70/20H10N70/823H10N70/231H10N70/8828H10N70/8833H01L21/22H10N70/8825
Inventor 山·D·唐约翰·K·扎胡拉克
Owner MICRON TECH INC
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