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Printed circuit board

A technology of printed circuit boards and transmission lines, applied in printed circuits, printed circuit components, circuit devices, etc., can solve problems such as discontinuous impedance, aggravated electromagnetic radiation, and affecting signal integrity

Inactive Publication Date: 2012-09-19
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, the impedance of the via hole is smaller than the impedance of the transmission line, so it may cause impedance discontinuity, which not only affects the signal integrity, but also aggravates the electromagnetic radiation to a certain extent.

Method used

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  • Printed circuit board
  • Printed circuit board
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Embodiment Construction

[0015] Below in conjunction with accompanying drawing and preferred embodiment the present invention is described in further detail:

[0016] Please refer to figure 1 , the first preferred embodiment of the printed circuit board of the present invention includes first to sixth layers 10-15, wherein, copper foil is laid on each layer, and a dielectric layer is arranged between each adjacent two layers. Dielectric, so that two adjacent layers are insulated from each other. In this embodiment, the first layer 10 and the sixth layer 15 are signal layers, and other layers are reference layers (including the ground layer and the power layer). In other implementation manners, the first to sixth layers 10-15 may also be other layers respectively.

[0017] A first transmission line 100 is disposed on the first layer 10 , the first end of the first transmission line 100 is used to receive a signal, and the second end is connected to a first via hole 16 . The first via hole 16 runs th...

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PUM

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Abstract

The invention relates to a printed circuit board which comprises a first layer, a second layer, a third layer, a fourth layer, a fifth layer and a sixth layer, wherein a first transmission line is arranged on the first layer; a first end of the first transmission line is used for receiving a signal; a second transmission line is arranged on the third layer; a third transmission line is arranged on the sixth layer; the first end of the second transmission line is connected with a second end of the first transmission line through a first through hole; the second end of the second transmission line is connected with the first end of the third transmission line through a second through hole; and the second end of the third transmission line is used for outputting the signal. The printed circuit board can enable an impedance of a transmission path between the first layer and the sixth layer to be better matched with the impedance of the first transmission line and the third transmission line.

Description

technical field [0001] The invention relates to a printed circuit board. Background technique [0002] Multilayer circuit boards are mainly used in the design of server motherboards, etc., and are characterized by having more signal layers, power layers, and ground layers. In the prior art, when a signal on a certain layer is transmitted to another layer, it is generally realized through via holes. Generally speaking, the impedance of the via hole is smaller than that of the transmission line, so it may cause impedance discontinuity, which not only affects the signal integrity, but also aggravates electromagnetic radiation to a certain extent. Contents of the invention [0003] In view of the above, it is necessary to provide a printed circuit board that can better match the impedance of the transmission path between the two layers to the impedance of the transmission line. [0004] A printed circuit board, comprising a first layer, a second layer, a third layer, a fourt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11
CPCH05K1/115H05K1/0251
Inventor 卫明李宁白家南许寿国
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD