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Reflow Soldering Equipment

A technology of reflow soldering and equipment, which is applied in the direction of metal processing, electrical component assembly and printed circuit, etc., can solve the problems of board dropping, unstable transportation, easy deformation, etc., to reduce energy consumption, improve board dropping, and save floor space Effect

Active Publication Date: 2016-07-06
SUNEAST ELECTRONICS TECH SHENZHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: to provide a reflow soldering equipment, which can effectively utilize the production site, save floor space, reduce energy consumption, facilitate transportation, and improve the easy deformation of the transportation guide rail after heating, resulting in board drop and transportation Unsteady problem

Method used

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Examples

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Embodiment Construction

[0024] Reference below Figure 2-Figure 4 Describe in detail an embodiment of the tower reflow furnace provided by the present invention; as shown in the figure, this embodiment mainly includes a plurality of temperature zones 1 and a PCB transmission mechanism 2 for transferring PCB boards in the plurality of temperature zones 1 At least two temperature zones 11, 13 of the plurality of temperature zones 1 are arranged up and down in a vertical direction, and the PCB transmission mechanism 2 includes at least a vertical transmission rail 21 for vertically transmitting the PCB in the temperature zones set up and down. .

[0025] In addition, the PCB transmission mechanism 2 also includes a horizontal transmission rail (not shown in the figure) that horizontally transmits the PCB in each temperature zone 2.

[0026] In addition, the entrance and exit of each temperature zone 1 are respectively provided with a board picking mechanism 31 and a board pushing mechanism 32 for picking an...

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Abstract

The invention discloses reflow soldering equipment which comprises a plurality of warm areas and a PCB (printed circuit board) drive mechanism for transmitting PCB boards in the warm areas, at least two warm areas are arranged along the vertical direction and from up to down, and the PCB drive mechanism at least comprises an vertical transmission guide for transmitting PCB boards among the warm areas arranged from up to down. The reflow soldering equipment can effectively utilize the production site, save the floor area, reduce the energy consumption, provide convenience for the transmission, and solve the problem that the after the transmission guide is heated, the distortion is easy to occur such that the PCB boards may be dropped and the transmission is not steady.

Description

Technical field [0001] The invention relates to the field of electronic circuit surface assembly equipment, and in particular to a reflow soldering equipment. Background technique [0002] Electronic circuit surface mount technology (SurfaceMount Technology, SMT), also known as surface mount or surface mount technology. It is a surface mount component (SurfaceMountedComponent, SMC) or surface mount device SurfaceMountedDevices, SMD) without leads or short leads, also known as chip components, mounted on the surface of a printed circuit board (PrintedCircuitBoard, PCB) or Circuit assembly technology in which the surface of other substrates is soldered and assembled by reflow soldering or dip soldering. The main process flow is: printing-patch-welding-overhaul (testing can be added to each process to control quality). Among them, the soldering process mainly uses reflow soldering equipment for soldering. [0003] Reflow soldering equipment is also called "reflow soldering equipmen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K3/00H05K3/34
Inventor 时曦徐晓芹
Owner SUNEAST ELECTRONICS TECH SHENZHEN
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