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Reflow soldering method and tool for CCGA-microwave device mixed printed board assembly

A microwave device, reflow soldering technology, applied in the direction of assembling printed circuits with electrical components, printed circuit manufacturing, electrical components, etc., to achieve the effects of stable and reliable device assembly quality, simple operation, and high-reliability assembly

Active Publication Date: 2022-02-11
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to solve the problem of how to realize the hybrid assembly of CCGA-microwave devices in a simple, effective, stable and reliable manner, and provides a reflow soldering process and tooling for CCGA-microwave device mixed printed board components

Method used

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  • Reflow soldering method and tool for CCGA-microwave device mixed printed board assembly
  • Reflow soldering method and tool for CCGA-microwave device mixed printed board assembly
  • Reflow soldering method and tool for CCGA-microwave device mixed printed board assembly

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Embodiment Construction

[0035] The above and other technical features and advantages of the present invention will be described in more detail below in conjunction with the accompanying drawings.

[0036] Such as figure 1 As shown, the main technical solution of this embodiment is to use the heat insulation screen to block the thermal effect, reduce the air volume reaching the surface of the device in the hot air reflow oven, and increase the heat capacity of the microwave device welding area through the heat shield of the tooling, so that the microwave area of ​​the printed board is in line with the The temperature difference is formed in other areas to achieve the integrated assembly of integrated microwave circuits and dedicated digital circuits of the same component, and solve the problem of incompatibility of soldering temperature between CCGA and microwave devices.

[0037] The printed board assembly selected in this embodiment requires a total of one CCGA packaged device and five microwave dev...

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Abstract

The invention relates to the technical field of electronic assembly, in particular to a reflow soldering method and tool for a CCGA-microwave device mixed printed board assembly, and the method comprises the steps: firstly, designing a stepped steel mesh according to a chip packaging form through a printing technology of a surface assembly technology, and completing the soldering paste printing on a printed board bonding pad; secondly, completing the chip mounting through a high-precision mounting technology, wherein the offset of the device pin is smaller than 10% of the width of the pin; thirdly, after surface mounting, adopting a tool heat shield for conducting heat protection on a microwave area, and designing a proper welding temperature curve to achieve welding. According to the reflow soldering method and the reflow soldering tool for the CCGA-microwave device mixed loading printed board assembly, the problem of how to simply, effectively and reliably realize CCGA-microwave device mixed loading with stable quality is solved.

Description

technical field [0001] The invention relates to the technical field of electronic assembly, in particular to a CCGA-microwave device mixed printed board component reflow soldering method and tooling. Background technique [0002] With the continuous development of electronic information technology, the requirements for modularization and light weight are increasing day by day. Integrated microwave circuits and dedicated digital circuits in the same component have the characteristics of high integration, miniaturization, and multi-function, and are gradually applied in the fields of aerospace, aviation, and electronics. . [0003] The CCGA package can implement many logic and microprocessor functions, and is suitable for larger sizes and more I / Os. CCGA packaged devices have the advantages of high pressure resistance, high temperature resistance, high reliability, high shock resistance, high assembly density, and high electrothermal performance. Integrating CCGA packaged chi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34H05K3/32
CPCH05K3/341H05K3/328Y02P70/50
Inventor 刘颖陈该青许春停吴瑛余鹏程田野张辉李盛鹏胡梦园付任郑少鹏王小宇
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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