LED (light emitting diode) lamp
A technology of LED lamps and LED chips, applied in lighting devices, cooling/heating devices of lighting devices, light sources, etc., can solve the problems of short heat dissipation path, low luminous efficiency, short life, etc., and achieve high heat dissipation efficiency and good heat dissipation effect. , the effect of convenient processing
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Embodiment 1
[0039] like Figure 1 to Figure 4 As shown, an LED lamp includes a light-transmitting lamp cover 1, a heat-dissipating PCB board 2, a heat-dissipating seat 10, a plurality of LED lamp beads 3 containing only one LED chip, a lamp holder 4, and positive and negative electrodes electrically connected to the LED lamp beads 3. The conductive layer of the layout circuit of the pins (not shown), the electric control device 5 electrically connected with the external power supply and the LED light emitting unit. The electric control device 5 is fixed on the lamp cap 4 . The LED lamp beads 3 are arranged in a similar pentagonal shape, fixed on the heat dissipation PCB board 2, the conductive layer of the layout circuit is directly arranged on the heat dissipation PCB board 2, and the LED lamp beads 3 and the conductive layer of the layout circuit are arranged on the same side of the heat dissipation PCB board 2 face.
[0040]The outer peripheral shape of the heat sink 10, the heat dis...
Embodiment 2
[0043] like Figure 5 As shown, an LED lamp includes a light-transmitting lamp cover 30, a plastic plate 37 forming a lens, a PCB board 31, a heat dissipation base 32, an LED light-emitting unit, and a layout circuit conductive layer (not shown) electrically connected to the LED light-emitting unit. output), an electric control device 34 and a lamp holder 35 electrically connected to the external power supply and the conductive layer of the layout circuit. The LED lighting unit includes an LED chip 36 , a lens 45 , and a gold wire 33 electrically connecting the LED chip 36 and the conductive layer of the layout circuit.
[0044] The heat dissipation base 32 includes an annular flat bottom plate, and a plurality of chip fixing bosses 40 protruding from the bottom plate integrally formed with the heat dissipation base 32 , and the fixing bosses 40 are all distributed on the same circumference. A fixing column 39 is extended on the end surface of the plastic plate 61 forming the...
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