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LED baseplate

A technology of LED substrate and LED lamp beads, which is applied to lighting devices, cooling/heating devices of lighting devices, light sources, etc., can solve the problems of unsatisfactory heat conduction, serious light decay, large thermal resistance, etc. Process, reduce light decay, good thermal conductivity and heat dissipation effect

Inactive Publication Date: 2012-09-26
吕能兵
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing LED lighting lamps are expensive, have serious light decay, and relatively short lifespan. The main reason is poor heat conduction, especially the installation of LED lamp beads and the insulating layer of the substrate, resulting in large thermal resistance and unsatisfactory heat conduction.

Method used

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples.

[0024] refer to Figure 1 to Figure 5 , an LED substrate, on which there is an installation device for LED lamp bead heat dissipation feet, install the LED lamp bead heat dissipation feet on the installation position, and then press them tightly, so that the LED lamp beads can be connected to the substrate, and the LED lamp bead heat sink is connected to the substrate cling.

[0025] After the LED lamp beads are installed on the substrate, they are connected or welded to the wires with conductive feet.

[0026] The LED substrate mentioned above can be used as an installation device for 1 lamp bead, or as an installation device for 2, 3, 5, 7, 9, 12, 20 or 30 LED lamp beads.

[0027] Wherein the LED substrate can be formed into a ci...

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Abstract

The invention belongs to the technical field of LED illuminating lamp application, and particularly discloses an LED baseplate, which includes LED lamp bead dissipation leg mounting positions in the baseplate, as well as screw hole positions and wire passing hole positions that are used for fixing the base plate. According to the invention, the heat conductivity coefficient of the LED baseplate is improved to the optimum, and the thermal resistance of an insulating layer is avoided. Moreover, the installation is convenient, the cost is low, the heat conduction and the heat dissipation effects are improved, and the service life of the LED lamp is prolonged.

Description

technical field [0001] The invention relates to the technical field of LED lighting applications, in particular to an LED substrate. Background technique [0002] LED lighting is a new high-tech industry, an energy-saving and environmentally friendly product that is recognized by the whole society, and is now being promoted and used by the country. [0003] Existing LED lighting lamps are expensive, have severe light decay, and relatively short lifespan. The main reason is poor heat conduction, especially the installation of LED lamp beads and the insulating layer of the substrate, resulting in large thermal resistance and unsatisfactory heat conduction. Contents of the invention [0004] In order to solve the above problems, the present invention provides an LED substrate with simple structure, low cost and best heat conduction effect. [0005] An LED substrate, including a mounting device for mounting LED lamp beads on the substrate, the LED mounting device is located o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V21/00F21V29/00F21Y101/02F21V29/503F21Y115/10
Inventor 吕能兵
Owner 吕能兵