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Probe structure and manufacturing method of diaphragm type probe

A manufacturing method and thin-film technology, which can be applied to the parts of electrical measuring instruments, measuring devices, instruments, etc., can solve the problem of difficult to make contact terminals for space converters

Inactive Publication Date: 2012-09-26
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the limited materials and processes of general space transformers, it is difficult to manufacture contact pitches that meet the current specifications of components or probe arrays to be tested.

Method used

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  • Probe structure and manufacturing method of diaphragm type probe
  • Probe structure and manufacturing method of diaphragm type probe
  • Probe structure and manufacturing method of diaphragm type probe

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0054] figure 1 A top view of the thin film probe 102 according to an embodiment is shown. The film probe 102 includes an insulating film 104 and a plurality of conductive strips 106 .

[0055] Please refer to figure 1 , the insulating film 104 has opposite first film sides 108 and second film sides 110 , and has opposite first film surfaces 112 and second film surfaces 114 . The insulating film 104 is made of flexible materials, including polymer materials commonly used in the packaging process, such as polyimide (polyimide; PI), polydimethylsiloxane (polydimethylsiloxane; PDMS), acrylic resin (Acrylate) or Benzocyclobutene (benzocyclobuten; BCB).

[0056] A plurality of conductive strips 106 are disposed on the first film surface 112 of the insulating film 104 . Each of the conductive strips 106 has a first conductive end 116 and a second conductive end 118 opposite to each other. In one embodiment, the first conductive end 116 extends beyond the first film side 108 of ...

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PUM

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Abstract

The invention relates to a probe structure and a manufacturing method of a diaphragm type probe. The probe structure comprises a diaphragm type probe which comprises an insulating diaphragm and a plurality of conductive strips. The insulating diaphragm has a first diaphragm surface and a second diaphragm which are opposite to each other, and a first diaphragm side edge and a second diaphragm side edge which are opposite to each other. The insulating diaphragm is made of flexible materials. The conductive strips are arranged on the first diaphragm surface of the insulating diaphragm. Each of the conductive strips has a first conductive tail end and a second conductive tail end which are opposite to each other. The first conductive tail end of each conductive strip extends to be beyond the first diaphragm side edge of the insulating diaphragm. The conductive strips which are separated from one another are arranged in a fan shape, so that intervals among first conductive tail ends of the conductive strips are smaller than that among the second conductive tail ends.

Description

technical field [0001] The present invention relates to a probe structure and a manufacturing method of a thin-film probe, in particular to a probe structure with a thin-film probe. Background technique [0002] The trend of semiconductor integrated circuit chips is towards miniaturization, and the unit density of components is getting higher and higher. Therefore, the size and spacing of signal input / output terminals such as bumps and pads of semiconductor integrated circuit chips will become smaller and smaller. , in response to the trend of chip miniaturization, the demand for micro-probes for testing chips will also be higher. [0003] Semiconductor integrated circuit chips need to pass through an electrical testing machine to confirm the circuit characteristics before shipment. In order to cope with the small size and spacing of the contact terminals and improve the efficiency of testing the component array, the electrical testing machine must use a fine probe array as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/067G01R1/073
Inventor 陈明坤郑明祥林义隆
Owner ADVANCED SEMICON ENG INC