Load lock chamber, substrate handling system and ventilation method

Abstract

A lock chamber for a substrate processing system is provided comprising at least a first conduit adapted to provide fluid communication of an interior portion of the lock chamber with atmospheric pressure or an overpressure. Furthermore, the lock-up chamber comprises at least a first control valve for controlling the flow rate of the inner part of the chamber in fluid communication with atmospheric pressure or overpressure, wherein the control valve is adapted to continuously control the flow rate. Furthermore, corresponding methods, computer programs and computer readable media suitable for carrying out the methods are provided.

Description

technical field [0001] Embodiments of the present invention relate to lock chambers, substrate processing systems and methods for venting, and in particular, to lock chambers. In particular, embodiments relate to an unload lock chamber and a method for venting an unload lock chamber. In particular, embodiments of the invention relate to nanofabrication technology solutions regarding equipment, processes and materials used in thin film and coating deposition, representative examples of which include (but are not limited to) the following: semiconductor and dielectric materials and devices, silicon-based wafers, flat-panel display devices (such as TFTs), masks and filters, electrochromic coatings, energy conversion and storage (such as photovoltaic cells, fuel cells, and batteries), solid-state lighting (such as LEDs and OLED), magnetic and optical storage, microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS), micro-optical and optoelectronic devices, ...

AI Technical Summary

Problems solved by technology

However, the proposed solutions are still too slow, or the damage rate of the substrate to be coated is still too high

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