Pallet and substrate processing equipment with pallet

A technology of processing equipment and trays, which is applied in the field of microelectronics, can solve problems such as uneven heating of trays, and achieve the effect of improving substrate processing efficiency and uniform temperature

Inactive Publication Date: 2012-10-10
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve at least one of the above-mentioned technical defects, especially the problem of uneven heating of the tray

Method used

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  • Pallet and substrate processing equipment with pallet
  • Pallet and substrate processing equipment with pallet
  • Pallet and substrate processing equipment with pallet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Such as figure 1 Shown is a longitudinal cross-sectional view of a tray according to an embodiment of the present invention. The tray 100 according to the embodiment of the present invention includes a tray body 110 having a hollow structure 111 inside the tray body 110. Among them, the hollow structure 111 is filled with a material with a lower melting point than the tray body 110, preferably a metal.

[0038] According to the tray 100 of the embodiment of the present invention, the tray body 110 is filled with a material whose melting point is lower than that of the tray body 110. During the induction heating process, when the temperature of the tray body 110 rises to the melting point of the filling material, the filling material melts into a liquid state. , The liquid filling material itself forms thermal convection to make its temperature uniform, and the liquid filling material forms heat exchange with the tray body, thereby reducing the temperature difference on the...

Embodiment 2

[0042] Such as figure 2 Shown is a longitudinal sectional view of a tray according to another embodiment of the present invention. In some embodiments of the present invention, the tray body 200 includes a first body 210 and a second body 220.

[0043] Wherein, the lower surface of the first body 210 has a first groove 211. The upper surface of the second body 220 has a second groove 221 that matches the first groove 211, and the first body 210 and the second body 220 are connected to each other so that the first groove 211 and the second groove 221 form the hollow structure. By providing the first groove 211 on the lower surface of the first body 210 and the second groove 221 on the upper surface of the second body 220, the processing of the first body 210 and the second body 220 is simpler and more convenient. In addition, preferably, in an embodiment of the present invention, the first body 210 and the second body 220 are connected through a first connection mechanism 213 p...

Embodiment 3

[0045] In addition, such as image 3 Shown is a longitudinal cross-sectional view of a tray according to another embodiment of the present invention. To make the design of the tray simpler, the tray body may further include a third body 310 and a fourth body 320.

[0046] Wherein, the fourth body 320 is disposed under the third body 310, such as image 3 As shown, a hollow structure 321 is formed in the fourth body 320. Preferably, the fourth body 320 and the third body 310 are connected by the second connecting mechanism 312. For example, the aforementioned second connecting device 312 may be a bolt or a pin.

[0047] In the embodiments 1-3 of the present invention, the tray body in any of the embodiments 1-3 is provided with a channel (such as figure 1 Shown channel 112, figure 2 Channel 212 shown, image 3 Channel 311 shown).

[0048] Following figure 1 Take the description as an example. The channel 112 is formed in the tray body 110, for example, it may be one or more channe...

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PUM

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Abstract

The invention provides a pallet, comprising: a tray body. The tray body has a hollow structure inside, wherein, the hollow structure is filled with a material, the melting point of which is lower than that of the tray body. The invention also provides substrate processing equipment, which comprises the above pallet. According to the substrate processing equipment of the present invention, when the temperature of the pallet reaches a certain temperature, the material filled in the pallet melts into a liquid. Therefore, characteristics of the liquid material make the surface temperature of the pallet more uniform, thereby raising temperature uniformity of MOCVD (metal organic chemical vapor deposition) conducted on a substrate by the substrate processing equipment. In addition, the pallet of the present invention has the advantages of simple structure, low cost and strong practicability.

Description

Technical field [0001] The invention relates to the field of microelectronics technology, in particular to a tray and a substrate processing equipment having the same. Background technique [0002] Induction heating is used for CVD (chemical vapor deposition) due to its advantages of fast heating speed, high efficiency, and high heating temperature, especially CVD equipment that needs to be heated to high temperatures, such as MOCVD (metal organic compound chemical vapor deposition). For CVD equipment used in industrial production, temperature uniformity can ensure the quality of the product, especially the temperature uniformity on the tray carrying the substrate plays an important role in the process performance. In order to achieve this temperature uniformity, Aixtron can be used at present The planetary structure uses a horizontal induction heating coil to heat the entire large graphite tray. The large tray carries a small tray that can rotate. The small tray rotates to achie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/458C23C16/46
Inventor 徐亚伟
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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