High temperature-distributed load thermal strength test device for plane structure of high-speed missile aerobat

A technology of planar structure and distributed load, applied in the direction of applying stable tension/pressure to test the strength of materials, etc., can solve the problems of difficult simulation of distributed load, rubber body rupture, liquid leakage, etc., and achieve important military engineering application value and device structure Conciseness and the effect of protecting security
CN102721612AInactive Publication Date: 2012-10-10BEIHANG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
BEIHANG UNIV
Publication Date
2012-10-10
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a high temperature-distributed load thermal strength test device for a plane structure of a high-speed missile aerobat, which comprises a plane high-temperature heating unit, a high-speed missile plane test piece, a thermostability insulation thin layer, a temperature thermocouple, a computer, a water sac loader, flexible heat insulation materials, a steel stressing plate, a hydraulic pressure actuator, a loading link rod, a ceramic frame and a force transducer, a thermal environment with a temperature above 1,000 DEG C is generated by the plane high-temperature heating unit, and a flexible heat separation is carried out between the water sac loader which can generate distributed load and a heat source. According to the thermal strength test device, uniform high-temperature distributed load is implemented to the plane structure of the high-speed missile in the thermal environment with a temperature above 1,000 DEG C, and a high temperature load test method closer to the actual stressing state is provided for a safe design of the high-speed missile structure. The device has important application values on military engineering.
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Description

technical field

[0001] The invention relates to a high-temperature-distributed load thermal strength test device for a planar structure of a high-speed missile aircraft. Especially when simulating the thermal environment of missile hypersonic flight, it can generate a high-temperature thermal environment of up to 1000°C on the plane structure of the missile, and apply distributed loads at the same time. It provides an effective high temperature-distributed load joint test method for the development of hypersonic missiles and high-speed aerospace vehicles. Background technique

[0002] As aircraft such as missiles are designed to fly faster and faster, the surface temperature of the aircraft generated by aerodynamic heating is also increasing. Under extremely harsh high-temperature thermal environment conditions, the thermal strength of high-speed aircraft materials and structures has become a key issue related to the success of development. This is because the high tempera...

Claims

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