High temperature-distributed load thermal strength test device for plane structure of high-speed missile aerobat

A technology of planar structure and distributed load, applied in the direction of applying stable tension/pressure to test the strength of materials, etc., can solve the problems of difficult simulation of distributed load, rubber body rupture, liquid leakage, etc., and achieve important military engineering application value and device structure Conciseness and the effect of protecting security

Inactive Publication Date: 2012-10-10
BEIHANG UNIV
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AI Technical Summary

Problems solved by technology

At room temperature, the rubber water bladder can be pressurized to simulate the distributed load, but due to the limited temperature resistance of the rubber water bladder, it will cause the rubber body to r

Method used

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  • High temperature-distributed load thermal strength test device for plane structure of high-speed missile aerobat
  • High temperature-distributed load thermal strength test device for plane structure of high-speed missile aerobat

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Embodiment Construction

[0021] Such as figure 1 and figure 2 As shown, the present invention consists of a ceramic base 1, a plane high-temperature heating body 2, a high-speed missile plane test piece 3, a high-temperature insulating thin layer 4, a temperature-measuring thermocouple 5, a computer 6, a water bag loader 7, and a flexible heat-insulating material 8. It consists of a steel force plate 9, a hydraulic actuator 10, a loading link 11, a ceramic frame 12, and a force sensor 13. A plane high-temperature heating sheet 2 is placed on the ceramic base 1, and a high-speed missile plane test piece 3 is pressed on the plane high-temperature heating body 2. The top and bottom of the plane high-temperature heating body 2 are covered with a high-temperature-resistant insulating thin layer 4, and the temperature measurement thermoelectric The couple 5 is placed on the lower side of the high-speed missile plane test piece 3, and the temperature measuring thermocouple 5 is connected with the computer ...

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Abstract

The invention discloses a high temperature-distributed load thermal strength test device for a plane structure of a high-speed missile aerobat, which comprises a plane high-temperature heating unit, a high-speed missile plane test piece, a thermostability insulation thin layer, a temperature thermocouple, a computer, a water sac loader, flexible heat insulation materials, a steel stressing plate, a hydraulic pressure actuator, a loading link rod, a ceramic frame and a force transducer, a thermal environment with a temperature above 1,000 DEG C is generated by the plane high-temperature heating unit, and a flexible heat separation is carried out between the water sac loader which can generate distributed load and a heat source. According to the thermal strength test device, uniform high-temperature distributed load is implemented to the plane structure of the high-speed missile in the thermal environment with a temperature above 1,000 DEG C, and a high temperature load test method closer to the actual stressing state is provided for a safe design of the high-speed missile structure. The device has important application values on military engineering.

Description

technical field [0001] The invention relates to a high-temperature-distributed load thermal strength test device for a planar structure of a high-speed missile aircraft. Especially when simulating the thermal environment of missile hypersonic flight, it can generate a high-temperature thermal environment of up to 1000°C on the plane structure of the missile, and apply distributed loads at the same time. It provides an effective high temperature-distributed load joint test method for the development of hypersonic missiles and high-speed aerospace vehicles. Background technique [0002] As aircraft such as missiles are designed to fly faster and faster, the surface temperature of the aircraft generated by aerodynamic heating is also increasing. Under extremely harsh high-temperature thermal environment conditions, the thermal strength of high-speed aircraft materials and structures has become a key issue related to the success of development. This is because the high tempera...

Claims

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Application Information

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IPC IPC(8): G01N3/18
Inventor 吴大方潘兵赵寿根刘华王岳武
Owner BEIHANG UNIV
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