Unlock instant, AI-driven research and patent intelligence for your innovation.

Packaging substrate and method of fabricating same

A technology for packaging substrates and manufacturing methods, which is applied in printed circuit manufacturing, semiconductor/solid-state device manufacturing, printed circuits, etc., can solve the problems of wasting the layout area of ​​packaging substrates, decreasing the overall circuit distribution density, and difficult to improve the overall circuit wiring density, etc. Achieve the effect of saving quantity, improving the overall wiring density, and saving the substrate area

Inactive Publication Date: 2012-10-17
UNIMICRON TECH CORP
View PDF3 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] However, in the existing manufacturing process of conductive vias and blind holes, a metal layer is electroplated on the comprehensively formed conductive layer, that is, the surface of the through holes and blind holes completely covers the metal layer, and only includes a conductive path, that is, A conductive via and a blind hole can only be connected to an independent circuit conduction path, resulting in a waste of the layout area of ​​the package substrate, and it is difficult to increase the wiring density of the overall circuit
[0020] Therefore, how to avoid the conductive vias and blind holes in the prior art including only one conduction path, resulting in a decrease in the density of the overall circuit distribution, and the inability to make full use of the layout area of ​​the packaging substrate has become an urgent problem to be solved at present.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packaging substrate and method of fabricating same
  • Packaging substrate and method of fabricating same
  • Packaging substrate and method of fabricating same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0063] see Figure 3A To FIG. 3I , it is a cross-sectional view of the first embodiment of the packaging substrate and its manufacturing method of the present invention, wherein, Figure 3I-2 for Figure 3I-1 different examples of Figure 3I-1 and Figure 3I-1 "' are respectively along its top view Figure 3I-1 ’The sectional view and perspective view of the sectional line CC’, Figure 3I-1 "for Figure 3I-1 different embodiments of ’, Figure 3I-2 and Figure 3I-2 "' are respectively along its top view Figure 3I-2 'and Figure 3I-2 The sectional view and perspective view of the sectional line DD' of ", Figure 3I-2 "for Figure 3I-2 ’ different examples.

[0064] Such as Figure 3A As shown, a core board 30 is provided with a first surface 30 a and a second surface 30 b opposite to each other, and a first metal layer 31 is formed on the first surface 30 a and the second surface 30 b.

[0065] Such as Figure 3B As shown, a tapered via hole 300 is formed through...

no. 2 example

[0078] see Figure 4A to Figure 4K , which is a cross-sectional view of the second embodiment of the packaging substrate and its manufacturing method of the present invention, wherein, Figure 4K and Figure 4K ’-2 are respectively along its top view Figure 4K The sectional view and perspective view of the sectional line EE' of '-1, Figure 4K "-1 with Figure 4K "-2 respectively Figure 4K ’-1 with Figure 4K Different embodiments of '-2.

[0079] This embodiment is roughly the same as the first embodiment, the main difference is that this embodiment further applies the inventive concept of the first embodiment to the manufacture of blind holes.

[0080] Such as Figure 4A As shown, a base material 40 is provided, and a surface of the base material 40 has a plurality of electrical connection pads 41. The base material 40 can be a core board, for example, a core board of a packaging substrate with a core layer that is finally produced. Alternatively, the substrate 40 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A packaging substrate includes a core board having a first surface and an opposite second surface; at least a conic through hole formed in the core board and penetrating the first and second surfaces; a plurality of conductive paths formed on a wall of the conic through hole, free from being electrically connected to one another in the conic through hole; and a plurality of first circuits and second circuits disposed on the first and second surfaces of the core board, respectively, and being in contact with peripheries of two ends of the conic through hole, wherein each of the first circuits is electrically connected through each of the conductive paths to each of the second circuits. Compared to the prior art, the packaging substrate has a reduced number of through holes or vias and an increased overall layout density, so the overall volume and the production cost of the packaging substrate are reduced.

Description

technical field [0001] The invention relates to a packaging substrate and a manufacturing method thereof, in particular to a packaging substrate with through holes or blind holes and a manufacturing method thereof. Background technique [0002] With the vigorous development of the electronic industry, electronic products have gradually entered the trend of multi-functional and high-performance research and development. In order to meet the packaging requirements of high integration and miniaturization of semiconductor packages, more active , Passive components and circuit connections, the packaging substrate used to carry semiconductor chips must accommodate more circuits and components under the same packaging substrate unit in order to meet the needs of integrated circuits with high circuit density. [0003] Generally speaking, the packaging substrate is composed of many lines, blind holes and through holes, and then the chip is connected to the packaging substrate, and th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L21/48H05K1/11
CPCH01L21/486H01L23/49827H05K2201/09645H01L2924/00013H05K2201/0959H05K2201/09827H05K3/403H05K3/427H01L2924/0002H01L2224/13099H01L2224/13599H01L2224/05599H01L2224/05099H01L2224/29099H01L2224/29599H01L2924/00
Inventor 胡文宏郑兆孟黄煜翔邱雅萍
Owner UNIMICRON TECH CORP