Large inductance integrated magnetic induction device and manufacturing method thereof
A magnetic induction and device technology, which is applied in semiconductor/solid-state device manufacturing, inductors, electric solid-state devices, etc., can solve problems such as the inability to realize single-chip circuit integration of magnetic devices with large inductance values
Active Publication Date: 2015-08-26
THE HONG KONG UNIV OF SCI & TECH
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[0005] However, conventional inductive device technologies cannot achieve monolithic integration of large inductance magnetic devices
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[0028] One or more embodiments are now described with reference to the drawings, wherein like reference numerals are used to refer to like elements throughout. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various embodiments. It is evident, however, that various embodiments may be practiced without these specific details (eg, may not apply to any particular environment or standard). In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing embodiments in additional detail.
[0029] Various non-limiting embodiments of the methods and apparatus presented herein provide integrated magnetic sensing devices capable of operating with small resistance values and large inductance values within the small device area of a monolithic integrated circuit.
[0030] In one embodiment, a magnetic induction device includes a ...
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Methods and apparatus described herein are associated with integrated magnetic induction devices. A magnetic induction device can include a groove formed in a substrate, a magnetic core included in the groove and surrounded by a conductive winding that is adjacent to portion(s) of the substrate, and respective insulation layers included between the substrate and the conductive winding and between the magnetic core and the conductive winding. An inductor can further include conductive vias formed in the substrate and connected to respective portions of the conductive winding. Further, a transformer can include a groove formed in a substrate, a closed-loop / gapped magnetic core included in the groove and surrounded by first and second conductive windings that are adjacent to respective portions of the substrate, and respective insulation layers formed between the substrate and the first and second conductive windings, and between the closed-loop / gapped magnetic core and the first and second conductive windings.
Description
[0001] priority claim [0002] This application claims priority to U.S. Provisional Patent Application No. 61 / 457,447, filed March 30, 2011, entitled "LARGE INDUCTANCE INTEGRATED MAGNETIC INDUCTION DEVICE AND ITS METHOD OF FABRICATION THEREOF," which is incorporated by reference in its entirety This article. technical field [0003] The present disclosure generally relates to sensing devices and fabrication methods, including, but not limited to, high inductance integrated magnetic sensing devices and fabrication methods thereof. Background technique [0004] Magnetic sensing devices, including inductors and transformers, are widely used in power electronics applications such as switch-mode power supplies. In these applications, magnetic sensing devices with large inductance values (eg, hundreds of microhenries) and low resistance values can be used to achieve desirable circuit performance. Thus, such a magnetic induction device may utilize a magnetic core having a lar...
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IPC IPC(8): H01L23/64H01L21/02H10N97/00
CPCH01L28/10H01L2924/0002H01F17/0033H01L23/5227H01L2924/00
Inventor 单建安伍荣翔方向明
Owner THE HONG KONG UNIV OF SCI & TECH