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An active thermal management device and thermal management method

A thermal management and active technology, applied in cooling/heating devices of lighting devices, lighting devices, heat storage equipment, etc., can solve problems such as lack of energy, heat dissipation, and high operating temperature

Inactive Publication Date: 2015-03-25
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The performance and life of many electronic components degrade with temperature-increased operation, and lacking a suitable means to dissipate excess heat, many such electronic components operate at unfavorably high temperatures

Method used

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  • An active thermal management device and thermal management method
  • An active thermal management device and thermal management method
  • An active thermal management device and thermal management method

Examples

Experimental program
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Embodiment Construction

[0027] figure 1 is a schematic diagram of the first active thermal management device. The system includes an active thermal management device 10 positioned between a thermal energy source 20 and a thermal energy pool 30 . The active thermal management device 10 includes a phase change material unit 40 and two switches 50 and 60 . The switch 50 is arranged between the phase change material unit 40 and the thermal energy source 20 ; the switch 60 is arranged between the phase change material unit 40 and the thermal energy pool 30 . The switches are thermal switches, that is, they provide a switchable or selective thermal path between the phase change material unit 40 and the corresponding thermal energy source and thermal energy pool. When the switch is on there is a thermal path through which thermal energy passes and is transferred between the corresponding thermal energy source and thermal energy pool of thermal energy and the phase change material unit 40; when the switch ...

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Abstract

An active thermal management device and method are disclosed, in which a phase change material unit, comprising one or more phase change material arranged in thermally in series or parallel, is connectable to a source of thermal energy, such as a group of LEDs at a first operating condition. Thermal energy from the source of thermal energy is stored in the phase change material unit. The phase change material unit is connectable to a sink of thermal energy, such as a second group of LEDs at a second operating condition. The thermal energy stored in the phase change material unit may be re-used by connecting the sink of thermal energy. In one embodiment, the first operating condition includes a supply voltage of 15V, and the second operating condition includes either no supply voltage, or a lower supply voltage of 9V, such that excess heat from the first group of of LEDs, which may be over-temperature, can be re-used to pre-heat the second group of LEDs, thereby improving the thermal matching and thus optical matching.

Description

technical field [0001] The invention relates to an active heat management device and a heat management method. Background technique [0002] Thermal management of microelectronic devices and circuits is well known. For many years, heat sinks have been attached to electronic components in order to dissipate excess heat generated within the component. The performance and life of many electronic components degrade with temperature-increased operation, and lacking a suitable means to dissipate excess heat, many such electronic components operate at undesirably high temperatures. This applies not only to microelectronic components, but also to optoelectronic components such as LEDs, lasers, etc. [0003] Conventional heat sinks operate by radiating and / or conducting heat away from the electronic components to be cooled. Therefore, electronic components are thermal energy sources. Such heat sinks may be referred to as passive thermal management systems. Active thermal managem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20F28D15/00
CPCH01L2924/0002F28D2021/0029F21V29/00H01L23/4275F21V29/02F28D20/02F28F2013/008H01L33/62F21V29/004H01L23/427F21V29/54F21S2/005F21V29/50F21V29/51F21V29/71F21Y2115/10
Inventor 拉杜·苏尔代亚努代明·莱诺贝尔
Owner NXP BV