Elastomer to substrate bonding

A technology for a substrate and a bonding composition, which is used in the bonding application field of rubber and metal, and can solve problems such as aggravated mold pollution, highly toxic operation and safety problems.

Active Publication Date: 2012-10-17
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, the high toxicity of these dinitroso compounds poses serious handling and safety problems
Dinitroso compounds can manifest as fumes at high temperatures, which exacerbates the problem of mold contamination

Method used

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  • Elastomer to substrate bonding
  • Elastomer to substrate bonding
  • Elastomer to substrate bonding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0084] Examples of primer formulations:

[0085] Compound name

weight%

Pergut S130 (a)

8.3

Titanium dioxide

5.1

carbon black

1.3

Aerosil 200 (b)

1.3

Zinc oxide

1.7

Elaztobond A250 (c)

4.2

SP1055 (d)

5.1

methyl isobutyl ketone

63.0

Xylene

10.0

[0086] (a) Chlorinated rubber (available from Bayer Material Science); (b) Fumed silica (available from Evonik); (c) Phenolic resin (available from SI Group); (d) Phenolic resin (available from SI Group).

[0087] Adhesive formulation 1:

[0088] Compound name

weight%

Pergut S130 (a)

2.0

Xylene

70.8

Titanium dioxide

2.0

Heucophos ZPA (b)

2.1

Zinc oxide

4.2

Chlorosulfonated polyethylene (c)

5.5

HVA-2 (d)

1.1

4,4-Diphenylbismaleimide

1.1

Hydropho...

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Abstract

A bonding composition comprising at least an encapsulated aromatic nitroso compound, or an aromatic nitroso compound precursor and an encapsulated oxidant, or an encapsulated aromatic nitroso compound precursor and optionally encapsulated oxidant is provided. The compositions may find utility in polymer to metal, in particular, rubber to metal bonding. The aromatic nitroso compound or aromatic nitroso compound precursor may be nitrosobenzene / dinitrosobenzene or nitrosobenzene / dinitrosobenzene precursor respectively. The nitrosobenzene or dinitrosobenzene precursor may be a quinone oxime or a quinone dioxime.

Description

technical field [0001] The present invention relates to the use of encapsulated substances in adhesive compositions suitable for bonding polymers to substrates, such as elastomers to substrates; for example polymers to metals, Examples include elastomer-to-metal, including rubber-to-metal bonding applications. One aspect of the present invention provides novel compositions suitable for such bonding applications, and particularly for rubber to metal bonding applications. Background technique [0002] The bonding of polymers to metals, especially rubber to metals, has been practiced for many years. There are many applications of formulations for achieving polymer or rubber to metal bonds. Rubber-to-metal bonding is widely used to bond dissimilar metals to natural or synthetic rubber. Bonding of polymers to metals is done for a number of reasons. [0003] One aspect of rubber-to-metal bonding is combining the structural strength of metal with the elasticity of rubber. Thus...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K5/32C08K5/33C08K9/10
CPCC08K5/14C08K5/544C08K5/32C08K9/10C09J115/00C09J123/34Y10T428/31551
Inventor N·费伊B·J·科尼夫赛D·诺兰S·沃伦
Owner HENKEL KGAA
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