The invention relates to the technical field of photovoltaic cells, in particular to a preparation method of a surface-strengthened
silicon wafer substrate of a photovoltaic
cell, which comprises the following steps of: texturing the
silicon wafer substrate, and performing surface strengthening treatment twice to obtain the surface-strengthened
silicon wafer substrate; the two times of surface strengthening treatment are specifically as follows: during the first time of surface strengthening treatment, an
etching solution A is adopted to smooth the surface appearance defects of the silicon wafer substrate, and during the second time of surface strengthening treatment, an
etching solution B is adopted to smooth the surface
lattice defects of the silicon wafer substrate, the acidic
etching solution as the etching solution B comprises
hydrofluoric acid, an
oxidizing agent and deionized water, and the
oxidizing agent is one or a combination of more of a
nitro compound and a
nitroso compound. The method has the beneficial effects that through two times of surface strengthening treatment, the bending
breaking strength of the silicon wafer substrate is improved, and the bending
breaking strength of the
crystalline silicon photovoltaic
cell is finally improved; the method can be completed without special equipment, and has the advantages of being low in production cost and suitable for large-scale production.