The invention relates to the technical field of adhesives, in particular to a high-reactivity
adhesive for a heat-vulcanized rubber surface at a low temperature and a preparation method of the
adhesive. The
adhesive is prepared from the following raw materials in percentage by
mass: 1-15% of a film-forming agent, 5-20% of a rubber base material, 3-15% of a modified latent curing agent, 5-15% of phenolic resin and the balance of a
solvent. According to the invention, p-aminobenzene
sulfonyl guanidine is preferably selected to modify p-dinitrosobenzene,
active nitrogen atoms of p-dinitrosobenzene are captured at a
depolymerization temperature of p-dinitrosobenzene, and existence of a
polymerization state is avoided, so that the curing and bonding functions can be fully exerted under a low-temperature reaction condition, and low-
temperature limit vulcanization is realized. Meanwhile, the thermosetting phenolic resin with high
free phenol content is used in a matched manner, so that an interface penetration type cross-linking reaction is realized, the
bonding strength of the adhesive is improved, and the bonding stability of a low-temperature reaction part in the center of a shock insulation support product is ensured.