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Cutting device

A technology of cutting device and holding mechanism, which is applied in the direction of electrical components, circuits, and parts of grinding machine tools, etc., which can solve the problems of rising manufacturing cost of cutting devices, long time-consuming adjustment process, complicated mechanical structure, etc., and achieve high-speed operation , high cutting performance, and the effect of improving cutting performance

Inactive Publication Date: 2015-05-27
TECHNO HOLON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] As described above, currently widely used cutting devices have complex mechanical structures for moving the main shaft, and must be manufactured while adjusting the operation of the main shaft holding mechanism at the manufacturing stage, and this adjustment process takes a long time.
Therefore, the manufacturing cost of the cutting device increases

Method used

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Embodiment Construction

[0111] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, each figure schematically shows each structural part so that the present invention can be understood. Each drawing is an example of the present invention, and does not limit the present invention to the examples in the drawings. In addition, in each figure, the same code|symbol is attached|subjected to the same component, and the overlapping description of these functions etc. may be abbreviate|omitted.

[0112]

[0113] First, before describing the cutting device according to the embodiment of the present invention, the structure and operation of a conventional typical cutting device will be described. Next, the problems to be solved by the present invention are specifically clarified.

[0114] figure 1 It is a figure which shows the schematic structure of the conventional typical cutting apparatus. figure 1 Structural elements are limited to the range...

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Abstract

The invention provides a small-scale cutting device characterized in that low center of gravity of the integral device is realized, the movement of a main shaft in the Z-axis direction is not required, and a main shaft maintaining mechanism is simplified. A Z-axis moving mechanism (34) surrounds a theta rotation mechanism (16). An integrated Z-axis-theta-axis mechanism (50) characterized by lowered position of the center of gravity is assembled to the side of a workbench maintaining mechanism (40). Through lowering of the position of the center of gravity, the amplitude of vibration generated in the cutting device by a workbench (24) moving along the directions of X-axis, Y-axis, and theta-axis at high speed is reduced. Besides, without the Z-axis moving mechanism (34), the main shaft maintaining mechanism (32) does not generate procession along with the movement of the main shaft.

Description

technical field [0001] The invention relates to a cutting device. In particular, the invention relates to a cutting device that realizes lowering of the center of gravity of the structural portion of the table holding mechanism and lowering of the structural portion of the spindle holding mechanism, thereby improving cutting performance. Background technique [0002] The cutting device moves the rotary blade relative to the workpiece such as semiconductor or electronic component material as the processing object along the cutting direction, cutting feed direction and index feed direction, and cuts the workpiece into a square shaped (chip) device. [0003] Here, for convenience of explanation, a rectangular coordinate system composed of mutually orthogonal X-axis, Y-axis, and Z-axis is set as follows with respect to the cutting device. That is, the cutting direction is the Z-axis direction, the index feed direction is the Y-axis direction, and the cutting feed direction is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B49/12H01L21/301
Inventor 中村正治田中知行粟子谷张晋勇
Owner TECHNO HOLON