Heat-dissipation device

Abstract

A heat-dissipation device comprises a heat-dissipation base, a plurality of fins fixed on the heat-dissipation base, and a plurality of fixing pieces arranged on the heat-dissipation base in a penetrating manner, wherein the heat-dissipation base comprises a bottom plate, a top plate and a plurality of heat pipes interlaid between the top plate and the bottom plate; the heat-dissipation base also comprises a frame body interlaid between the bottom plate and the top plate and surrounding the heat pipes; the frame body comprises a plurality of frame strips that are in end-to-end connection with each other sequentially; a containing space is defined by the frame strips, the bottom plate and the top plate to contain the heat pipes; each of the fixing pieces penetrates through the bottom plate, the frame strips of the frame body and the top plate. As the frame body is connected with the peripheries of the bottom plate and the top plate, the heat-dissipation device avoids the deformation of the bottom plate and the top plate due to the fact that the bottom plate and the top plate are relatively thin and have a difficulty in bearing lock forces of the fixing pieces, the strength of the heat-dissipation device is effectively improved, and the heat pipes are well protected.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for dissipating heat from electronic components. Background technique [0002] In recent years, with the development of the electronics industry, the performance of electronic components has been continuously improved, and the calculation speed has become faster and faster. The calculation speed of the internal chipset has been continuously improved, the number of chips has continued to increase, and the heat emitted by the chips has also increased accordingly. If If the heat is not dissipated in time, the performance of the electronic components will be greatly affected, and the computing speed of the electronic components will be reduced. As the heat continues to accumulate, the electronic components may be burned, so the electronic components must be dissipated. [0003] A traditional radiator includes a bottom plate, a top plate, and a plurality of heat p...

AI Technical Summary

Problems solved by technology

Since the bottom and top boards often need to be pierced with fixing parts, if the bottom and top boards are thin, it will be difficult to withstand the locking force of the fixing parts and deform. If the bottom and top boards are too thick, unnecessary material waste will be caused; especially for radiators In the case of high heat dissipation performance requirements, both the bottom plate and the top plate are made of expensive copper materials. Once the thickness increases, the overall manufacturing cost of the heat sink will increase.

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