Solar battery and manufacturing method thereof

Abstract

A solar cell includes a semiconductor substrate and a first antireflective layer. The semiconductor substrate has a first-type semiconductor surface and a second-type semiconductor surface opposite to each other. The first antireflective layer includes a plurality of refraction convexes and a coverage layer. The refraction convexes are formed on the second-type semiconductor surface. Each refraction convex includes a first refraction part and a second refraction part. The first refraction parts are conformally coated with the respective second refraction parts, and the first refraction part is configured to have a refractive index greater than the refractive index of the second refraction part. The coverage layer is formed to cover the second-type semiconductor surface and the refraction convexes, and the coverage layer is configured to have a refractive index smaller than the refractive index of the second refraction part. A solar cell manufacturing method is also provided.

Description

technical field [0001] The invention relates to a solar cell and its manufacturing method, and in particular to a solar cell with a microstructure anti-reflection layer and its manufacturing method. Background technique [0002] Please refer to figure 1 , which is a schematic cross-sectional view of a known solar cell. Such as figure 1 As shown, a known solar cell 1 includes a semiconductor substrate 10 , a first antireflection layer 11 , a second antireflection layer 12 , a first electrode 13 and a second electrode 14 . The semiconductor substrate 10 has an N-type semiconductor surface 101 and a P-type semiconductor surface 102 opposite to each other. The first anti-reflection layer 11 is disposed on the N-type semiconductor surface 101 , and the second anti-reflection layer 12 is disposed on the P-type semiconductor surface 102 . The first electrode 13 and the second electrode 14 are respectively in contact with the N-type semiconductor surface 101 and the P-type semic...

AI Technical Summary

Problems solved by technology

However, during the wet etching process of the semiconductor substrate 10, the semiconductor substrate 10 is often excessively damaged due to the difficulty in controlling the concentration of the acidic etching solution and the process temperature, thereby affecting the relationship between the N-type semiconductor surface 101 and the P-type semiconductor surface 102. The conduction efficiency of electrons and holes between them leads to a decrease in the photoelectric conversion efficiency of solar cells 1

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